Conforming heat sink assembly

• US 6,367,541 B2
• Filed: 05/07/2001
• Issued: 04/09/2002
• Est. Priority Date: 05/06/1999
• Status: Active Grant

• Current Assignee: Ticona Polymers, Inc. (Celanese Corporation)
• Original Assignee: Cool Options, Inc.
• Inventors: McCullough, Kevin A.
• Primary Examiner(s): FLANIGAN, ALLEN J
• Application Number:
  US09/850,017
• Publication Number:
  US 20010047858A1
• Time in Patent Office: 337 Days
• Field of Search: 165/185, 165/80.3, 298/900.3, 174/16.3, 361/704, 361/697, 361/710, 257/722
• US Class Current: 165/80.3
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/433 Auxiliary members in containers characterised by their shape, e.g. pistons
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A conforming heat sink assembly for removing heat from heat generating components, having respective top surfaces defining different heights is provided with a flexible thermally conductive base member with a top surface and a bottom surface. The bottom surface is adapted to be positioned in flush thermal communication with the top surfaces of each of the components. The bottom portions of a heat dissipating element are embedded in a flexible thermally conductive base member. The heat dissipating member is corrugated to define a number of lower contact points and upstanding fin members. The lower contact points are movable relative to one another in accordance with the top surface of the flexible thermally conductive base member. The heat dissipating element is affixed to the flexible thermally conductive base member at its lower contact points to form a conforming heat sink assembly.

Claims

1. A conforming heat sink assembly for removing heat from electronic components, having respective top surfaces defining different heights, installed on a circuit board, comprising:

a flexible thermally conductive base member having a top surface and a bottom surface;

said bottom surface being adapted to be positioned in flush thermal communication with the top surfaces of each of said electronic components installed on a circuit board;

said bottom surface of said thermally conductive base member defining a plurality of regions therein;

said plurality of regions being capable of residing in different planes than one another with each of said plurality of regions residing in planes that are substantially parallel to said top surfaces of said electronic components;

a heat dissipating element embedded in said upper surface of said flexible thermally conductive base member;

said heat dissipating member being corrugated and defining a plurality of lower contact points and upstanding fin members;

said heat dissipating member having an undulating cross-section with a plurality of valleys defining said lower contact points and a plurality of peaks defining said upstanding fin members;

said lower contact points being movable relative to one another in accordance with said top surface of said flexible thermally conductive base member and in a direction substantially perpendicular to said top surfaces of said electronic components and said lower contact points of said heat dissipating member being capable of lying in different planes than one another and conforming to said top surface of said thermally conductive base member;

said lower contact points of said heat dissipating element being embedded in said flexible thermally conductive base member.

2. The conforming heat sink assembly of claim 1, wherein said heat dissipating element is inserted molded into said thermally conductive base member.

3. The conforming heat sink assembly of claim 1, wherein said thermally conductive base member is made of carbon-carbon matrix material.

4. The conforming heat sink assembly of claim 1, wherein said heat dissipating member is made of aluminum.

5. A conforming heat sink assembly for removing heat from electronic components, having respective top surfaces defining different heights, installed on

a circuit board, comprising:

a flexible thermally conductive base member having a top surface and a bottom surface and being manufactured of a carbon-carbon matrix material;

said bottom surface being adapted to be positioned in flush thermal communication with the top surfaces of each of said electronic components installed on a circuit board;

said bottom surface of said thermally conductive base member defining a plurality of regions therein;

said plurality of regions being capable of residing in different planes than one another with each of said plurality of regions residing in planes that are substantially parallel to said top surfaces of said electronic components;

a heat dissipating element embedded in said upper surface of said flexible thermally conductive base member;

said heat dissipating member being corrugated and defining a plurality of lower contact points and upstanding fin members;

said heat dissipating member having an undulating cross-section with a plurality of valleys defining said lower contact points and a plurality of peaks defining said upstanding fin members;

said lower contact points being movable relative to one another in accordance with said top surface of said flexible thermally conductive base member and in a direction substantially perpendicular to said top surfaces of said electronic components and said lower contact points of said heat dissipating member being capable of lying in different planes than one another and conforming to said top surface of said thermally conductive base member;

said lower contact points of said heat dissipating element being embedded in said flexible thermally conductive base member.

6. The conforming heat sink assembly of claim 5, wherein said heat dissipating element is inserted molded into said thermally conductive base member.

7. The conforming heat sink assembly of claim 5, wherein said heat dissipating member is made of aluminum.

8. The method of manufacturing a heat sink assembly, comprising the steps of:

providing a flexible thermally conductive base member having a top surface and a bottom surface;

said bottom surface being adapted to be positioned in flush thermal communication with the top surfaces of electronic components installed on a circuit board;

said bottom surface of said thermally conductive base member defining a plurality of regions therein;

said plurality of regions being capable of residing in different planes than one another with each of said plurality of regions residing in planes that are substantially parallel to said top surfaces of said electronic components; and

partially embedding a heat dissipating element in said upper surface of said flexible thermally conductive base member;

said heat dissipating member being corrugated and defining a plurality of lower contact points and upstanding fin members;

said heat dissipating member having an undulating cross-section with a plurality of valleys defining said lower contact points and a plurality of peaks defining said upstanding fin members;

said lower contact points being movable relative to one another in accordance with said top surface of said flexible thermally conductive base member and in a direction substantially perpendicular to said top surfaces of said electronic components and said lower contact points of said heat dissipating member being capable of lying in different planes than one another and conforming to said top surface of said thermally conductive base member.

9. The method of claim 8, wherein said heat dissipating element is embedded into said thermally conductive base member by insert molding.