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Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes

  • US 6,368,184 B1
  • Filed: 01/06/2000
  • Issued: 04/09/2002
  • Est. Priority Date: 01/06/2000
  • Status: Expired due to Term
First Claim
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1. A polishing pad of a polishing tool, comprising:

  • a polishing surface;

    a back surface that is opposite the polishing surface;

    at least one sender electrode disposed in the polishing pad, said at least one sender electrode being comprised of a first end positioned proximate the polishing surface, and a second end positioned proximate the back surface, the first end of the at least one sender electrode being comprised of a brush; and

    at least one response electrode disposed in the polishing pad, the at least one response electrode adapted to communicate with the at least one sender electrode through a conductive process layer of a wafer during a polishing process.

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