Apparatus for determining metal CMP endpoint using integrated polishing pad electrodes
First Claim
1. A polishing pad of a polishing tool, comprising:
- a polishing surface;
a back surface that is opposite the polishing surface;
at least one sender electrode disposed in the polishing pad, said at least one sender electrode being comprised of a first end positioned proximate the polishing surface, and a second end positioned proximate the back surface, the first end of the at least one sender electrode being comprised of a brush; and
at least one response electrode disposed in the polishing pad, the at least one response electrode adapted to communicate with the at least one sender electrode through a conductive process layer of a wafer during a polishing process.
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Abstract
A polishing system includes a polishing tool having a platen, a polishing pad, and a controller. The platen is adapted to have the polishing pad attached thereto. The polishing pad includes a polishing surface and a back surface that is opposite the polishing surface. At least one sender electrode and at least one response electrode is disposed in the polishing pad. The controller is coupled to the polishing tool. A method includes polishing a conductive process layer of a wafer using a polishing pad of a polishing tool having at least one sender electrode and at least one response electrode disposed therein. A signal is provided to the at least one sender electrode. The signal provided to the at least one sender electrode is monitored with at least one of a group of the at least one response electrode, the at least one response electrode communicating with the at least one sender electrode through the conductive process layer of the wafer. Endpoint of the polishing process is determined based on the signal received by the at least one response electrode.
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Citations
50 Claims
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1. A polishing pad of a polishing tool, comprising:
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a polishing surface;
a back surface that is opposite the polishing surface;
at least one sender electrode disposed in the polishing pad, said at least one sender electrode being comprised of a first end positioned proximate the polishing surface, and a second end positioned proximate the back surface, the first end of the at least one sender electrode being comprised of a brush; and
at least one response electrode disposed in the polishing pad, the at least one response electrode adapted to communicate with the at least one sender electrode through a conductive process layer of a wafer during a polishing process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A polishing system, comprising:
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a polishing tool having a platen and a polishing pad, said platen adapted to have said polishing pad attached thereto, the polishing pad comprising;
a polishing surface;
a back surface that is opposite the polishing surface;
at least one sender electrode disposed in the polishing pad;
at least one response electrode disposed in the polishing pad;
at least one power supply plane positioned on said platen, said at least one sender electrode being aligned with said at least one power supply plane; and
a controller coupled to the polishing tool. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
provide a signal to the at least one sender electrode during a polishing process;
monitor the signal provided to the at least one sender electrode by monitoring the at least one response electrode, the at least one response electrode communicating with the at least one sender electrode through a conductive process layer of a wafer; and
determine endpoint of the polishing process based on the signal received by the at least one response electrode.
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22. The polishing process of claim 21, wherein the controller is adapted to:
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monitor at least one response electrode of the polishing pad;
calculate a number of the at least one response electrode not receiving the signal from the at least one sender electrode; and
determine endpoint of the polishing process based on a predetermined percentage of the at least one response electrodes not receiving the signal.
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23. The polishing system of claim 21, wherein the controller is adapted to:
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monitor the signal received by at least one response electrode;
measure a change in an electrical characteristic of the signal provided to the at least one sender electrode and the signal received by the at least one response electrode;
determine endpoint of the polishing process based on a predetermined change in an electrical characteristic of the signal.
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24. A polishing pad of a polishing tool, comprising:
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a polishing surface;
a back surface that is opposite the polishing surface;
at least one sender electrode disposed in the polishing pad, said at least one sender electrode being comprised of a first end positioned proximate the polishing surface, and a second end positioned proximate the back surface, the second end of the sender electrode being substantially planar with the back surface; and
at least one response electrode disposed in the polishing pad, the at least one response electrode adapted to communicate with the at least one sender electrode through a conductive process layer of a wafer during a polishing process. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
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33. A polishing pad of a polishing tool, comprising:
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a polishing surface;
a back surface that is opposite the polishing surface;
at least one sender electrode disposed in the polishing pad; and
at least one response electrode disposed in the polishing pad, the at least one response electrode adapted to communicate with the at least one sender electrode through a conductive process layer of a wafer during a polishing process, said at least one response electrode being comprised of a first end positioned proximate the polishing surface, and a second end positioned proximate the back surface, the first end of the at least one response electrode being comprised of a brush. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41)
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42. A polishing pad of a polishing tool, comprising:
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a polishing surface;
a back surface that is opposite the polishing surface;
at least one sender electrode disposed in the polishing pad; and
at least one response electrode disposed in the polishing pad, the at least one response electrode adapted to communicate with the at least one sender electrode through a conductive process layer of a wafer during a polishing process, said at least one response electrode being comprised of a first end positioned proximate the polishing surface, and a second end positioned proximate the back surface, the second end of the at least one response electrode being substantially planar with the back surface. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49, 50)
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Specification