Adjustable energy quantum thin film plasma processing system

• US 6,368,477 B1
• Filed: 11/10/1999
• Issued: 04/09/2002
• Est. Priority Date: 04/07/1995
• Status: Expired due to Fees

• Current Assignee: Advanced Energy Industries Incorporated
• Original Assignee: Advanced Energy Industries Incorporated
• Inventors: Scholl, Richard A.
• Primary Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US09/438,254
• Time in Patent Office: 881 Days
• Field of Search: 204/298.03, 204/298.06, 204/298.08, 156/345, 118/723.VE, 118/723.E
• US Class Current: 204/298.08
• CPC Class Codes: C23C 14/3407 Cathode assembly for sputtering apparatus, e.g. Target
• CPC Class Codes: C23C 14/54 Controlling or regulating the coating process
• CPC Class Codes: H01J 37/32064 Circuits specially adapted for controlling the arc discharge for plasma torches H01H1/36
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/3299 Feedback systems

Abstract

A thin film plasma processing system which includes multiple power environments and circuitry is described so as to encompass a variety of configurations. The environments may establish an energy quantum which may be interactively adjusted such as for conditioning or processing when new targets or materials are inserted. The energy quantum can be increased from the traditionally low energy storage of a switch-mode power supply to a higher energy to allow more intense arc occurrences and, thus, the more rapid conditioning of a target. Switching between environments can be achieved manually or automatically through timing or through arc or plasma electrical characteristics sensing. Energy quantum may be adjusted through the inclusion of energy storage elements, hardwired elements, or through software configurations such as are possible with the utilization of a programmable processor. Applications for DC switch-mode thin film processing systems are specifically shown.

Claims

1. A multiple power non arc-based thin film plasma processing system comprising:

a. a switch-mode power supply;

b. a coating chamber having an anode and cathode;

c. a solid material disposed within said coating chamber;

d. a first power control system to which said switch-mode power supply is responsive and which affirmatively powers an arc preparatory to non arc-based processing;

e. a second power control system to which said switch-mode power supply is responsive and which achieves non arc-based processing; and

f. a switch to which said first and second power control systems are each responsive and which acts while said switch-mode power supply is operating.

2. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system and said second power control system each establish an arc energy quantum and wherein the arc energy quantum established by said first power control system is different from the arc energy quantum established by said second power control system.

3. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system and said second power control system each have a reaction time and wherein the reaction time of said first power control system is different from the reaction time of said second power control system.

4. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system and said second power control system each have a current threshold level and wherein the current threshold level of said first power control system is different from the current threshold level of said second power control system.

5. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system and said second power control system each have a voltage threshold level and wherein the voltage threshold level of said first power control system is different from the voltage threshold level of said second power control system.

14. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system comprises response delay circuitry which is responsive to said switch.

16. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system comprises an arc energy storage element which is responsive to said switch.

18. A multiple power non arc-based thin film plasma processing system as described in claim 1 or 2 and further comprising a processing timer element which is responsive to said first power control system.

20. A multiple power non arc-based thin film plasma processing system as described in claim 1, 6, or 2 and further comprising a sensor which is responsive to electrical conditions of a plasma.

21. A multiple power non arc-based film plasma processing system as described in claim 1, 6, or 2 and further comprising an arc detector which is responsive to electrical conditions of a plasma.

22. A multiple power non arc-based thin film plasma processing system as described in claim 18 wherein said switch is responsive to said processing timer element.

24. A multiple power non arc-based thin film plasma processing system as described in claim 20 wherein said switch is responsive to said sensor.

25. A multiple power non arc-based thin film plasma processing system as described in claim 21 wherein said switch is responsive to said arc detector.

26. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system comprises a timer.

28. A multiple power non arc-based thin film plasma processing system as described in claim 26 or 27 wherein said timer comprises circuit elements.

29. A multiple power non arc-based thin film plasma processing system as described in claim 26 or 27 wherein said timer comprises a programmable processor.

34. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said first power control system has energy storage capability and wherein said energy storage capability may be physically altered.

35. A multiple power non arc-based thin film plasma processing system as described in claim 1 wherein said switch-mode power supply comprises:

a. a DC power source;

b. an AC generator responsive to said DC power source;

c. an AC to DC converter responsive to said AC generator; and

d. a DC output stage, wherein said DC output stage comprises conditioning circuitry and non arc-based processing circuitry.

6. A multiple power non arc-based thin film plasma processing system comprising:

a. a switch-mode power supply;

b. a coating chamber having an anode and cathode;

c. a solid material disposed within said coating chamber;

d. conditioning circuitry responsive to said switch-mode power supply which affirmatively powers an arc;

e. non arc-based processing circuitry responsive to said switch-mode power supply; and

f. a switch to which said conditioning and non arc-based processing circuitry are each responsive.

7. A multiple power non arc-based thin film plasma processing system as described in claim 6 wherein said conditioning circuitry and said non arc-based processing circuitry each have an arc energy quantum and wherein the arc energy quantum of said conditioning circuitry is different from the arc energy quantum of said non arc-based processing circuitry.

8. A multiple power non arc-based thin film plasma processing system as described in claim 7 wherein said switch-mode power supply comprises:

a. a DC power source;

b. an AC generator responsive to said DC power source;

c. an AC to DC converter responsive to said AC generator; and

d. a DC output stage, wherein said DC output stage comprises said conditioning circuitry and said non arc-based processing circuitry.

13. A multiple power non arc-based thin film plasma processing system as described in claim 6 wherein an arc energy quantum of said conditioning circuitry is greater than an arc energy quantum of said non arc-based processing circuitry.

15. A multiple power non arc-based thin film plasma processing system as described in claim 6 wherein said conditioning circuitry comprises response delay circuitry which is responsive to said switch.

17. A multiple power non arc-based thin film plasma processing system as described in claim 6 wherein said conditioning circuitry comprises an arc energy storage element which is responsive to said switch.

19. A multiple power non arc-based thin film plasma processing system as described in claim 6 and further comprising a processing timer element which is responsive to said conditioning circuitry.

23. A multiple power non arc-based thin film plasma processing system as described in claim 19 wherein said switch is responsive to said processing timer element.

27. A multiple power non arc-based thin film plasma processing system as described in claim 6 wherein said conditioning circuitry comprises a timer.

9. A multiple power non arc-based thin film plasma processing system comprising:

a. a switch-mode power supply having an arc occurrence reaction time;

b. a coating chamber having an anode and cathode connected to said switch-mode power supply;

c. a solid material disposed within said coating chamber; and

d. a variable reaction control which changes said arc occurrence reaction time.

10. A multiple power non arc-based thin film plasma processing system as described in claim 9 wherein said variable reaction control acts to change said arc occurence reaction time while said switch-mode power supply said power source is operating.

11. A multiple power non arc-based thin film plasma processing system as described in claim 10 wherein said variable reaction control comprises circuit elements.

12. A multiple power non arc-based thin film plasma processing system as described in claim 10 wherein said variable reaction control comprises a programmable processor.

30. A multiple power non arc-based thin film plasma processing system comprising:

a. a DC power source;

b. an AC generator responsive to said DC power source;

c. an AC to DC converter responsive to said AC generator;

d. a coating chamber having a cathode and an anode;

e. a capacitive element capable of storing arc energy which may be released by an arc and which is in parallel with said cathode and said anode; and

f. a switch to which said capacitive element is responsive and which selectively acts to allow said capacitive element to store said arc energy during processing and to prevent said capacitive element from storing said arc energy during processing.

31. A multiple power non arc-based thin film plasma processing system comprising:

a. a DC power source;

b. an AC generator responsive to said DC power source;

c. an AC to DC converter responsive to said AC generator;

d. a coating chamber having a cathode and an anode;

e. an inductive element capable of storing arc energy which may be released by an arc and which is in series with said cathode and said anode; and

f. a switch to which said inductive element is responsive and which selectively acts to allow said inductive element to store said arc energy during processing and to prevent said inductive element from storing said arc energy during processing.

32. A multiple power non arc-based thin film plasma processing system comprising:

a. a switch-mode power supply;

b. a coating chamber having a cathode and an anode responsive to said switch-mode power supply;

c. a switch which reacts while said switch-mode power supply is operating; and

d. a variable, arc occurrence reaction timer to which said switch-mode power supply is responsive during operation.

33. A multiple power non arc-based thin film plasma processing system as described in claim 32 wherein said switch-mode power supply comprises:

a. a DC power source;

b. an AC generator responsive to said DC power source; and

c. an AC to DC converter responsive to said AC generator.