Dual track/stepper interface configuration for wafer processing
First Claim
Patent Images
1. A method for processing semiconductor wafers comprising:
- providing a first coater and developer track having a first coater station and a first developer station;
providing a second coater and developer track having a second coater station and a second developer station;
providing a single stepper between the first coater and developer track and the second coater and developer track;
coating a first set of wafers with a photoresist material in the first coater station;
exposing the first set of wafers with a light source in the stepper;
developing the first set of wafers with a developer in the first developer station;
coating a second set of wafers with a second photoresist material in the second coater station;
exposing the second set of wafers with the light source in the stepper; and
developing the second set of wafers with the developer in the second developer station.
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Abstract
An apparatus for processing semiconductor wafers includes a single imaging stepper for exposing wafers processed on a first track and a second track. A method for processing semiconductor wafers includes selecting one of a first coater and a second coater for coating a first wafer with a photoresist. The coated wafer is exposed in a single stepper to form an exposed wafer. An operator selects one of a first developer and second developer to develop the exposed wafer.
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Citations
20 Claims
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1. A method for processing semiconductor wafers comprising:
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providing a first coater and developer track having a first coater station and a first developer station;
providing a second coater and developer track having a second coater station and a second developer station;
providing a single stepper between the first coater and developer track and the second coater and developer track;
coating a first set of wafers with a photoresist material in the first coater station;
exposing the first set of wafers with a light source in the stepper;
developing the first set of wafers with a developer in the first developer station;
coating a second set of wafers with a second photoresist material in the second coater station;
exposing the second set of wafers with the light source in the stepper; and
developing the second set of wafers with the developer in the second developer station. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for processing semiconductor wafers comprising:
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providing a first track having a first coater and a first developer connected to and adjacent the first coater;
providing a second track having a second coater and a second developer connected to and adjacent the second coater;
providing a single stepper between the first track and the second track;
selecting one of the first coater and the second coater;
coating a first wafer with a photoresist from the one of the selected first and second coaters to form a coated wafer;
exposing the coated wafer with an image in the single stepper to form an exposed wafer; and
selecting one of the first developer and second developer;
developing the exposed wafer in the one of the selected first developer and second developer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for processing semiconductor wafers comprising:
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providing a first coater/developer track having a first coater station and a first developer station;
providing a second coater/developer track having a second coater station and a second developer station;
arranging the first and second coater/developer tracks perpendicular to one another such that they form an ā
Lā
shape;
providing a single stepper adjacent one end of the first coater/developer track and adjacent one end of the second coater/developer track;
coating a first set of wafers with a first photoresist material in the first coater station;
coating a second set of wafers with a second photoresist material in the second coater station; and
alternatingly exposing one of the wafers of the first set of wafers and one of the wafers of the second set of wafers with a light source in the stepper. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification