SPM base focal plane positioning
First Claim
Patent Images
1. A method for accurate photolithography tool Z axis positioning comprising:
- providing a photolithography tool having a scanned probe microscope mounted directly to the lens system hardware;
determining a focal plane using calibration wafers;
positioning a wafer at the scanner probe microscope tip; and
driving a stage to move the wafer to the determined focal plane.
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Abstract
A method and apparatus for positioning a wafer in an electron beam lithography system. This method includes the steps of positioning a scanned probe microscope in the lithography system, and determining the distance between a preset location on the scanned probe microscope and a reference position in the lithography system. The wafer is brought into physical contact with that preset location, and then the wafer is moved a predetermined distance from the preset location on order to position the wafer at the desired focal plane in the lithography system.
19 Citations
16 Claims
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1. A method for accurate photolithography tool Z axis positioning comprising:
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providing a photolithography tool having a scanned probe microscope mounted directly to the lens system hardware;
determining a focal plane using calibration wafers;
positioning a wafer at the scanner probe microscope tip; and
driving a stage to move the wafer to the determined focal plane.
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2. A method for positioning a wafer in an electron beam lithography system, comprising:
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positioning a scanned probe microscope in the lithography system;
determining the distance between a preset location on the scanned probe microscope and a reference position in the lithography system;
bringing the wafer into physical contact with said preset location; and
moving the wafer a predetermined distance from the preset location in order to position the wafer at a focal plane in the lithography system. - View Dependent Claims (3, 4, 5, 6)
the moving step includes the step of moving the wafer along said given axis to position the wafer at said focal plane.
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4. A method according to claim 3, wherein the electron beam lithography system includes a lens for focusing the electron beam onto the wafer, and the reference position is a fixed position relative to said lens.
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5. A method according to claim 4, wherein the positioning step includes the step of mounting the scanned probe microscope onto the lens at a fixed position relative to the lens.
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6. A method according to claim 5, wherein the scanned probe microscope includes a bottom tip, and the bringing step includes the step of bringing the wafer into contact with the bottom tip of the scanned probe microscope.
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7. A method for dynamically positioning a wafer in an electron beam lithography system, comprising:
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positioning a scanned probe microscope in the lithography system;
determining the distance between a preset location on the scanned probe microscope and a reference position in the lithography system;
bringing the wafer into physical contact with said preset location;
moving the wafer a predetermined distance from the preset location in order to position the wafer at a focal plane in the lithography system;
moving the wafer within the lithography system to form patterns on a plurality of areas on the wafer; and
repeating the steps of bringing the wafer into physical contact with said preset location and moving the wafer a predetermined distance, in order to position each of said plurality of areas at the focal plane when a pattern is being formed on the area. - View Dependent Claims (8, 9, 10, 11)
the step of moving the wafer a predetermined distance includes the step of moving the wafer along said given axis to position the wafer at said focal plane.
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9. A method according to claim 8, wherein the electron beam lithography system includes a lens for focusing the electron beam onto the wafer, and the reference position is a fixed position relative to said lens.
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10. A method according to claim 9, wherein the positioning step includes the step of mounting the scanned probe microscope onto the lens at a fixed position relative to the lens.
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11. A method according to claim 10, wherein the scanned probe microscope includes a bottom tip, and the bringing step includes the step of bringing the wafer into contact with the bottom tip of the scanned probe microscope.
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12. A system for positioning a wafer in an electron beam lithography system, comprising:
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a scanned probe microscope positioned in the lithography system;
means for determining the distance between a preset location on the scanned probe microscope and a reference position in the lithography system;
means for bringing the wafer into physical contact with said preset location; and
means for moving the wafer a predetermined distance from the preset location in order to position the wafer at a focal plane in the lithography system. - View Dependent Claims (13, 14, 15, 16)
the moving means includes means for moving the wafer along said given axis to position the wafer at said focal plane.
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14. A system according to claim 13, wherein the electron beam lithography system includes a lens for focusing the electron beam onto the wafer, and the reference position is a fixed position relative to said lens.
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15. A system according to claim 14, further including means mounting the scanned probe microscope onto the lens at a fixed position relative to the lens.
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16. A system according to claim 15, wherein the scanned probe microscope includes a bottom tip, and the bringing means includes means for bringing the wafer into contact with the bottom tip of the scanned probe microscope.
Specification