×

Multi-layer planar inductance coil and a method for producing the same

  • US 6,369,685 B1
  • Filed: 01/07/2000
  • Issued: 04/09/2002
  • Est. Priority Date: 07/10/1997
  • Status: Expired due to Fees
First Claim
Patent Images

1. A multi-layer inductance coil on a first portion of a first plate-shaped support (10) which has a plurality of first conducting layers (14) which extend parallel to each other, and which support is made for holding and contacting further electronic components (32), wherein at least one conducting layer (14) of said plurality of first conducting layers, which forms a first electrical winding, is cooperating with a core (24) which is provided for guiding a magnetic flux and which is to be arranged in said first portion, whereinat least one second plate-shaped support (20;

  • 22;

    44;

    54) with a plurality of second conducting layers (16;

    18) is provided on said first portion, which layers extend substantially parallel to each other, said second support being parallel to said first support (10) such that at least one of the plurality of second conducting layers (16) of the second support, which provides a second electrical winding, can form an inductance with said core (24) and said first electrical winding, and wherein said second support is connected with said first support through laterally engaging connection elements, solder connection, or other contacting and fixing means.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×