Printed circuit board and method for its manufacture

• US 6,370,292 B1
• Filed: 08/24/1999
• Issued: 04/09/2002
• Est. Priority Date: 08/25/1998
• Status: Expired due to Fees

• Current Assignee: Nola Semiconductor LLC (Intellectual Ventures LLC)
• Original Assignee: Robert Bosch GmbH
• Inventors: Strake, Engelbert
• Primary Examiner(s): Ullah, Akm E.
• Assistant Examiner(s): CONNELLY, MICHELLE R
• Application Number:
  US09/382,258
• Time in Patent Office: 959 Days
• Field of Search: 385/14, 385/15, 385/31-33, 385/36, 385/47-49, 385/51, 385/52, 385/88-94, 385/39
• US Class Current: 385/14
• CPC Class Codes: G02B 6/10 of the optical waveguide type G02B6/02, G02B6/24 take precedence; devices or arrangements for the control of light by electric, magnetic, electro-magnetic or acoustic means G02F1/00; transferring the modulation of modulated light G02F2/00; optical logic elements G02F3/00; optical analogue/digital converters G02F7/00
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42

Abstract

An optoelectronic, multilayer printed circuit board having at least one layer to be fitted with components. The printed circuit board having an electrical printed circuit trace on the exterior of the layer structure and optical signal-transmission paths which are patterned as integrated multimode waveguides in a system having additional, optically transparent layers. According to this structure, a cost-effective implementation is achieved with respect to optical multimode interconnect lines with passive structures, coupling points for optical fibers and for optoelectronic components for transmitting and receiving optical signals, and conventional electrical signaling links on a shared carrier. The transparent layers are located in the interior of the layer structure, and largely conventional methods are used to pattern these layers.

Claims

1. An optoelectronic printed circuit board formed as a laminated multilayer stack, comprising:

at least one outer layer to be fitted with a plurality of components;

at least one electrical printed circuit trace provided on an exterior of the at least one outer layer;

a layer system including a plurality of additional, optically transparent layers and arranged with respect to the at least one outer layer; and

at least one optical signal-transmission path patterned in an arbitrary layout and cross-section in the layer system as an integrated multimode strip waveguide, wherein the layer system is located in an interior of the multilayer stack;

wherein;

the at least one outer layer includes a first outer layer and a second outer layer,

the at least one electrical printed circuit trace includes at least a first electrical printed circuit trace and a second electrical printed circuit trace,

the first outer layer flanks a first side of the layer system and is provided with at least the first electrical printed circuit trace, and

the second outer layer flanks a second side of the layer system and is provided with at least the second electrical printed circuit trace.

2. An optoelectronic printed circuit board formed as a laminated multilayer stack, comprising:

at least one outer layer to be fitted with a plurality of components;

at least one electrical printed circuit trace provided on an exterior of the at least one outer layer;

a layer system including a plurality of additional, optically transparent layers and arranged with respect to the at least one outer layer;

at least one optical signal-transmission path patterned in an arbitrary layout and cross-section in the layer system as an integrated multimode strip waveguide, wherein the layer system is located in an interior of the multilayer stack;

an optical waveguide core provided in the layer system;

an optoelectronic component;

an optical fiber; and

a microprism including a reflecting facet and provided in an opening extending through the at least one outer layer and at least a portion of the layer system in order to optically couple one of the optoelectronic component and the optical fiber to the multimode waveguide, wherein;

the reflecting facet of the microprism is located in a plane of the optical waveguide core, and

the microprism is secured in the opening using an adhesive agent matched to a refractive index such that a light bundle is deflected according to one of a path from a waveguide axis into an axis of the opening and a path from the axis of the opening to the waveguide axis.

3. The printed circuit board according to claim 2, wherein the adhesive agent occupies a gap between the microprism and a lateral surface of the opening in an area of the optical waveguide core.

4. A method for producing an optoelectronic printed circuit board formed as a laminated multilayer stack, comprising the steps of:

providing at least one outer component-fitted layer;

providing at least one electrical printed circuit trace on an exterior of the at least one outer component-fitted layer;

providing a layer system that includes a plurality of additional, optically transparent layers located in an interior of the multilayer stack;

patterning an optical signal-transmission path as an integrated multimode strip waveguide to define an optical waveguide core in the layer system;

providing an optoelectronic component;

providing an optical fiber;

providing a microprism including a reflecting facet in an opening extending through the at least one outer component-fitted layer and at least a portion of the layer system to optically couple one of the optoelectronic component and the optical fiber to the multimode waveguide;

locating the reflecting facet of the microprism in a plane of the optical waveguide core; and

securing the microprism in the opening using an adhesive agent matched to a refractive index such that a light bundle is deflected according to one of a path from a waveguide axis into an axis of the opening and a path from the axis of the opening to the waveguide axis, the step of securing the microprism including the steps of;

securing the microprism in the opening, and

after the microprism is secured in the opening, subsequently adjusting the optoelectronic component relative to the microprism and mounting the optoelectronic component on the microprism.

5. A method for producing an optoelectronic printed circuit board formed as a laminated multilayer stack, comprising the steps of:

providing at least one outer component-fitted layer;

providing at least one electrical printed circuit trace on an exterior of the at least one outer component-fitted layer,

providing a layer system that includes a plurality of additional, optically transparent layers located in an interior of the multilayer stack;

patterning an optical signal-transmission path an integrated multimode strip waveguide to define an optical waveguide core in the layer system;

providing an optoelectronic component;

providing an optical fiber;

providing a microprism including a reflecting facet in an opening extending through the at least one outer component-fitted layer and at least a portion of the layer system to optically couple one of the optoelectronic component and the optical fiber to the multimode waveguide;

locating the reflecting facet of the microprism in a plane of the optical waveguide core; and

securing the microprism in the opening using an adhesive agent matched to a refractive index such that a light bundle is deflected according to one of a path from a waveguide axis into an axis of the opening and a path from the axis of the opening to the waveguide axis, the step of securing the microprism including the steps of;

securing the microprism to the optoelectronic component, and

adjusting and securing both the microprism and the optoelectronic component in the opening.