Heater block cooling system for wafer processing apparatus

• US 6,370,796 B1
• Filed: 09/29/2000
• Issued: 04/16/2002
• Est. Priority Date: 09/29/2000
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.), Sony Electronics Inc. (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.), Sony Electronics Inc. (Sony Group Corp.)
• Inventors: Zucker, Daniel
• Primary Examiner(s): Esquivel, Denise L.
• Assistant Examiner(s): RINEHART, KENNETH
• Application Number:
  US09/675,157
• Time in Patent Office: 564 Days
• Field of Search: 344/28, 343/91, 343/93, 343/95, 34/61, 34/66, 118/724, 165/68, 165/80.3, 165/87
• US Class Current: 34/428
• CPC Class Codes: H01L 21/67109 mainly by convection

Abstract

A cooling system and method are provided for cooling a heater block located in a cylindrical processing chamber of a wafer processing apparatus. The cooling system includes first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of the processing chamber, and fan assemblies mounted to the frame assemblies at spaced locations therealong. A first pair of fan assemblies are directed to push air into the processing chamber, and a second pair of fan assemblies are directed to pull air out of the processing chamber. The fan assemblies are arranged such that they circulate ambient air through the processing chamber to provide a rapid cooling of the heater block to a safe working temperature. The frame assemblies have an adjustable length that can be adjusted to fit processing chambers having different sizes and configurations. The cooling system substantially reduces the cooling time required for the heater block to reach a safe working temperature as compared to conventional cooling by free convection.

Claims

1. A method for cooling a heater block contained within a processing chamber of a wafer processing apparatus, comprising the steps of:

providing processing chamber having a generally cylindrical shape, a top plate that covers the processing chamber during wafer processing, and a heater block positioned within the processing chamber;

removing the top plate to expose an open upper end of the processing chamber;

placing a cooling system across the open upper end of the processing chamber, said cooling system having a plurality of fan assemblies mounted to a frame at spaced locations therealong with at least a first one of said fan assemblies arranged to push air into the processing chamber and at least a second one of said fan assemblies arranged to pull air from the processing chamber; and

operating said first fan assembly to push air into the processing chamber and said second fan assembly to pull air from the processing chamber to circulate ambient air through said processing chamber for a sufficient time to cool said heater block to a safe working temperature.

2. The method for cooling a heater block according to claim 1, wherein said safe working temperature is approximately 50 to 60°

C.

3. The method for cooling a heater block according to claim 1, further comprising the steps of:

removing said cooling system from the open upper end of the processing chamber; and

placing said top plate back onto the upper end of the processing chamber to prepare said chamber for further wafer processing.

4. A cooling system for cooling a heater block in a processing chamber of a wafer processing apparatus, comprising:

first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of a processing chamber; and

a plurality of fan assemblies mounted to said frame assemblies at spaced locations therealong for circulating ambient air through said processing chamber;

wherein a length of said first and second frame assemblies is adjustable to conform to a size of the processing chamber.

5. The cooling system according to claim 4, wherein said adjustable length is provided by an elongated slot formed in an extension frame member of each of the first and second frame assemblies.

6. The cooling system according to claim 4, wherein said first frame assembly comprises a stationary frame member and an extension frame member, said frame members having respective first ends secured together and second ends adapted to rest on the upper peripheral surface of the processing chamber;

and wherein said extension frame member of each frame assembly has an elongated slot formed near said first end thereof, said stationary frame member of each frame assembly has a pair of bores near said first end thereof that are aligned with said elongated slot, and each frame assembly has a pair of threaded fasteners extending through said bores and said elongated slot to secure the extension frame member to the stationary frame member.

7. The cooling system according to claim 4, wherein said first frame assembly comprises a stationary frame member and an extension frame member, said frame members having respective first ends secured together and second ends adapted to rest on the upper peripheral surface of the processing chamber.

8. The cooling system according to claim 7, wherein said second frame assembly has substantially the same construction as said first frame assembly.

9. The cooling system according to claim 4 wherein said first and second frame assemblies are made of an aluminum material.

10. The cooling system according to claim 4 wherein a notched engagement structure is formed in each of the respective ends of the first and second frame assemblies, said notched engagement structure has a first portion that rests on the upper peripheral surface of the processing chamber and a second portion positioned adjacent an inner wall surface of the processing chamber.

11. A cooling system for cooling a heater block in a processing chamber of a wafer processing apparatus, comprising:

first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of a processing chamber; and

a plurality of fan assemblies mounted to said frame assemblies at spaced locations therealong for circulating ambient air through said processing chamber;

wherein said plurality of fan assemblies include a first fan assembly arranged to push air into the processing chamber and a second fan assembly arranged to pull air from the processing chamber.

12. The cooling system according to claim 11, wherein said plurality of fan assemblies comprise a third fan assembly arranged to push air into the processing chamber and a fourth fan assembly arranged to pull air from the processing chamber.

13. A cooling system for cooling a heater block in a processing chamber of a wafer processing apparatus;

comprising;

first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of a processing chamber; and

a plurality of fan assemblies mounted to said frame assemblies at spaced locations therealong for circulating ambient air through said processing chamber;

wherein said plurality of fan assemblies include a first fan assembly arranged to push air into the processing chamber, a second fan assembly arranged to pull air from the processing chamber, a third fan assembly arranged to push air into the processing chamber, and a fourth fan assembly arranged to pull air from the processing chamber; and

wherein said fan assemblies are arranged with the second fan assembly between the first and third fan assemblies, and the third fan assembly between the second and fourth fan assemblies.

14. The cooling system according to claim 13, wherein said fan assemblies each provide an air flow of approximately 105 cubic feet per minute.

15. In combination, a wafer processing apparatus having a cylindrical processing chamber and heater block contained within the processing chamber, and a cooling system for cooling the heater block, the cooling system comprising:

first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of said cylindrical processing chamber; and

first and second pairs of fan assemblies mounted to said frame assemblies at spaced locations therealong for circulating ambient air through said processing chamber;

wherein said fan assemblies are arranged in a single row along said frame assemblies and wherein said first pair of fan assemblies are arranged to push air into said processing chamber and said second pair of fan assemblies are arranged to pull air out of said processing chamber.

16. In combination, a wafer processing apparatus having a cylindrical processing chamber and a heater block contained within the processing chamber, and a cooling system for cooling the heater block, the cooling system comprising:

first and second frame assemblies having respective ends adapted to rest on an upper peripheral surface of said cylindrical processing chamber; and

a plurality of fan assemblies mounted to said frame assemblies at spaced locations therealong for circulating ambient air through said processing chamber;

wherein said processing chamber has an O-ring seal extending around the upper peripheral surface thereof, and said ends of the first and second frame assemblies are constructed to rest on the upper peripheral surface of the processing chamber within the diameter of the O-ring seal.

17. The combination according to claim 16, wherein said first and second frame assemblies are adjustable in length to fit a diameter of an upper end of said processing chamber.