Capacitive sensing array devices

• US 6,370,965 B1
• Filed: 09/25/2000
• Issued: 04/16/2002
• Est. Priority Date: 09/24/1999
• Status: Expired due to Fees

• Current Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Knapp, Alan G.
• Primary Examiner(s): NOORI, MAX H
• Application Number:
  US09/668,548
• Time in Patent Office: 568 Days
• Field of Search: 738/620.46, 738/620.41, 738/623.37, 738/625.2, 737/80
• US Class Current: 73/862.046
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger

Abstract

A capacitive sensing array device, particularly a fingerprint sensing array device, includes an array of sense electrodes covered by a layer of dielectric material defining a sensing surface over which, for example, a person'"'"'s finger is placed in use. Grounding conductors are provided adjacent the sensing surface and extending alongside one or more edges of the sense electrodes. The material of the dielectric layer in the region of the grounding conductors at least has a non-linear I-V characteristic whereby electrostatic charges occurring in the device structure are conducted through this material to the grounding conductors. The grounding conductors may be buried in the dielectric layer and second electrodes provided on the sensing surface overlying respective sense electrodes and overlapping the grounding conductors.

Claims

1. A capacitive sensing array device having a structure comprising an array of sense electrodes carried on a substrate and covered by a layer of dielectric material defining a sensing surface, said capacitive sensing array device further comprises grounding conductors adjacent to the sensing surface and extending alongside at least three edges of each of the sense electrodes, and the material of the dielectric layer at least at the region of the grounding conductors comprises a semi-insulating material having a non-linear current-voltage characteristic whereby electrostatic charges transferred to, or induced in, the device structure in use are conducted through the semi-insulating material to the grounding conductors.

2. A capacitive sensing array device according to claim 1, wherein the grounding conductors are provided below the sensing surface and each sense electrode is associated with second electrode which is carried on the sensing surface overlying the sense electrode and whose edge is in close proximity to a grounding conductor, and at least the region of the dielectric layer between the grounding conductors and the sensing surface comprises said semi-insulating material.

3. A capacitive sensing array device according to claim 2, wherein the edge of the second electrode is arranged to overlap a grounding conductor.

4. A capacitive sensing array device according to claim 3, wherein the grounding conductors are carried on the sensing surface and the material of the dielectric layer between the sense electrode and the sensing surface comprises said semi-insulating material.

5. A capacitive sensing array device according to claim 1, wherein the non-linear, semi-insulating material comprises a non-stoichimetric, silicon-rich, amorphous silicon alloy.

6. A capacitive sensing array device according to claim 1, wherein the non-linear, semi-insulating material comprises tantalum oxide.

7. A capacitive sensing array device according to claim 1, wherein the grounding conductors are provided in the form of a grid with each sense electrode being surrounded by a grid portion.

8. A capacitive sensing array device according to claim 1, wherein each sense electrode is coupled to a switching device carried on the substrate beneath the layer of dielectric material and connected to an address conductor which underlies a grounding conductor.

9. A capacitive sensing array device according to claim 8, wherein the switching device comprises a thin film diode or transistor.

10. A capacitive sensing array device according to claim 1, wherein the sensing array device is a fingerprint sensing device.

11. A fingerprint sensing system comprising a fingerprint sensing device according to claim 10, means responsive to an output from the sensing device to provide characteristical data of a sensed fingerprint, and means for comparing said characteristical data with stored characteristical data for one or more fingerprints.