Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method
First Claim
Patent Images
1. An exfoliating method for detaching a detached member disposed on a substrate with a separation layer therebetween, comprising:
- irradiating said separation layer with incident light from a side of said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said detached member from said substrate.
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Abstract
A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the thin film device to the transfer member with an adhesive layer therebetween, a step for irradiating the separation layer with light so as to form internal and/or interfacial exfoliation of the separation layer, and a step for detaching the substrate from the separation layer.
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Citations
78 Claims
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1. An exfoliating method for detaching a detached member disposed on a substrate with a separation layer therebetween, comprising:
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irradiating said separation layer with incident light from a side of said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said detached member from said substrate. - View Dependent Claims (13, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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2. An exfoliating method for detaching a detached member disposed on a transparent substrate with a separation layer therebetween, from said transparent substrate, comprising:
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irradiating said separation layer with incident light from a side of said transparent substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said detached member from said substrate.
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3. An exfoliating method for detaching a transferred layer, formed on a substrate with a separation layer therebetween, from said substrate, and for transferring said transferred layer onto a transfer member, comprising:
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adhering said transfer member to an opposite side of said transferred layer from said substrate, irradiating said separation layer with incident light from a side of said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said transferred layer from said substrate thereby transferring said transferred layer onto said transfer member. - View Dependent Claims (7, 8, 9, 10, 11, 12, 14)
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4. An exfoliating method for detaching a transferred layer, formed on a transparent substrate with a separation layer therebetween, from said transparent substrate, and for transferring said transferred layer onto a transfer member, comprising:
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adhering said transfer member to an opposite side of said transferred layer from said transparent substrate, irradiating said separation layer with incident light from a side of said transparent substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said transferred layer from said transparent substrate thereby transferring said transferred layer onto said transfer member.
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5. An exfoliating method comprising the steps of:
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forming a separation layer on a transparent substrate, forming a transferred layer on said separation layer directly or with an interlayer therebetween, adhering said transfer member to an opposite side of said transferred layer from said transparent substrate, irradiating said separation layer with incident light from a side of said transparent substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate, and detaching said transferred layer from said transparent substrate thereby transferring said transferred layer onto said transfer member. - View Dependent Claims (6)
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40. A method for transferring a thin film device on a substrate onto a transfer member comprising the steps of:
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forming a separation layer on said substrate;
forming a transferred layer including said thin film device on said separation layer;
adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
irradiating said separation layer with light from a side of said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate; and
detaching said substrate from said separation layer. - View Dependent Claims (52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77)
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41. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising:
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a first step of forming an amorphous silicon layer on said substrate;
a second step of forming said transferred layer including said thin film device on said amorphous silicon layer;
a third step of adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
a fourth step of irradiating said amorphous silicon layer with light from a side of said substrate through said substrate causing exfoliation in said amorphous silicon layer and/or at an interface of said amorphous silicon layer and said substrate and thereby decreasing an adhering force between said substrate and said transferred layer; and
a fifth step of detaching said substrate from said amorphous silicon layer;
wherein said transferred layer formed in said second step comprises a thin film transistor, and a thickness of said amorphous silicon layer formed in said first step is smaller than a thickness of a channel layer of said thin film transistor formed in said second step. - View Dependent Claims (44)
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42. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising:
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a first step of forming an amorphous silicon layer having a thickness of 25 nm or less on said substrate;
a second step of forming said transferred layer including said thin film device on said amorphous silicon layer;
a third step of adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
a fourth step of irradiating said amorphous silicon layer with light from a side of said substrate through said substrate causing exfoliation in said amorphous silicon layer and/or at an interface of said amorphous silicon layer and said substrate to decrease an adhering force between said substrate and said transferred layer; and
a fifth step of detaching said substrate from said amorphous silicon layer. - View Dependent Claims (43)
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45. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising the steps of:
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forming a separation layer on said substrate;
forming a silicon-based optical absorption layer on said separation layer;
forming said transferred layer including said thin film device on said silicon-based optical absorption layer;
adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
irradiating said separation layer with light from a side of said substrate through said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate; and
detaching said substrate from said separation layer. - View Dependent Claims (46)
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47. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising:
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a first step of forming a separation layer on said substrate;
a second step of forming said transferred layer including said thin film device on said separation layer;
a third step of adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
a fourth step of irradiating said separation layer with light from a side of said substrate through said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate; and
a fifth step of detaching said substrate from said separation layer;
wherein, in said fourth step, stress acting on upper layers above said separation layer in the exfoliation in said separation layer and/or at the interface, is absorbed by proof stress of said upper layers above said separation layer to prevent deformation and breakage of said layers above said separation layer. - View Dependent Claims (48)
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49. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising:
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a first step of forming a separation layer on said substrate;
a second step of forming said transferred layer including said thin film device on said separation layer;
a third step of adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
a fourth step of irradiating said separation layer with light from a side of said substrate through said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate; and
a fifth step of detaching said substrate from said separation layer;
wherein said fourth step includes sequential scanning of N beams for locally irradiating said separation layer, such that a region irradiated by an N-th beam (wherein N is an integer of 1 or more) does not overlap with regions irradiated by other beams.
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50. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising:
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a first step of forming a separation layer on said substrate;
a second step of forming said transferred layer including said thin film device on said separation layer;
a third step of adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
a fourth step of irradiating said separation layer with light from a side of said substrate through said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate; and
a fifth step of detaching said substrate from said separation layer;
wherein said fourth step includes sequential scanning of N beams for locally irradiating said separation layer, such that each beam has a flat peak region having a maximum optical intensity in a center, and the flat peak region irradiated by the N-th beam (wherein N is an integer of 1 or more) does not overlap with other irradiated flat peak regions irradiated by other beams.
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51. A method for transferring a transferred layer including a thin film device on a substrate onto a transfer member comprising:
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a first step of forming a separation layer on said substrate;
a second step of forming said transferred layer including said thin film device on said separation layer;
a third step of adhering said transferred layer including said thin film device to said transfer member with an adhesive layer;
a fourth step of irradiating said separation layer with light from a side of said substrate through said substrate causing exfoliation in said separation layer and/or at an interface of said separation layer and said substrate; and
a fifth step of detaching said substrate from said separation layer;
wherein said fourth step includes sequential scanning of N beams for locally irradiating said separation layer, such that each beam has a maximum optical intensity in a central region, and an effective region irradiated by the N-th beam (wherein N is an integer of 1 or more) having an intensity, which is 90% or more of a maximum intensity, does not overlap with other effective regions irradiated by other beams.
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78. An exfoliating method for detaching a detached member disposed on a substrate with a separation layer therebetween, from said substrate, comprising:
irradiating said separation layer with incident light from a side of said substrate causing detachment of at least said detached member from said substrate.
Specification