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Series and shunt mems RF switch

  • US 6,373,007 B1
  • Filed: 04/19/2000
  • Issued: 04/16/2002
  • Est. Priority Date: 04/19/2000
  • Status: Expired due to Fees
First Claim
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1. Integrated circuit radio frequency transmission line metallic mechanical electrical switching apparatus comprising the combination of:

  • an integrated circuit substrate member;

    a plurality of semiconductor material layers disposed on said substrate member, said semiconductor material layers including a plurality of electrical transistor members;

    a pair of parallel disposed metallic transmission line ground members traversing an upper surface portion of said semiconductor material layers;

    a metallic first radio frequency energy transmission line signal conveying member disposed between said pair of parallel disposed metallic transmission line ground members on said upper surface portion of said semiconductor material layers;

    said metallic first radio frequency energy transmission line signal conveying member interconnecting a switch output port location on said surface portion of said semiconductor material layers with one of a transmission line radio frequency source and load member;

    a second metallic radio frequency energy transmission line signal conveying member disposed between said pair of parallel disposed metallic transmission line ground members in extended alignment with said first radio frequency energy transmission line signal conveying member;

    said second metallic radio frequency energy transmission line signal conveying member including a selectively movable portion extending in overlap with a switch output port location part of said first metallic radio frequency energy transmission line signal conveying member and normally resident in one of;

    open switch relaxed spring physical segregation from said upper surface portion of said semiconductor material layers and said substrate member; and

    closed switch relaxed spring physical segregation from said upper surface portion of said semiconductor material layers and said substrate member and in proximity with an overlapping raised extended portion of said metallic first radio frequency energy transmission line signal conveying member;

    a metallic bridge member extending between said pair of parallel disposed metallic transmission line ground members, said bridge member being disposed in one of;

    being received on said upper surface portion of said semiconductor material layers and grounding said selectively movable portion of said second metallic radio frequency energy transmission line signal conveying member in a deformed spring, open switch, condition of said second metallic radio frequency energy transmission line signal conveying member; and

    being a raised center span metallic backstop member extending between said pair of parallel disposed metallic transmission line ground members over said selectively movable portion of said second radio frequency energy transmission line signal conveying member electrostatic force generating electrical potential apparatus connected between said first metallic radio frequency energy transmission line signal conveying member and said second metallic radio frequency energy transmission line signal conveying member and selectively generating a deformed spring electrical potential.

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