Method apparatus for a coaxial optical microscope with focused ion beam

• US 6,373,070 B1
• Filed: 10/12/1999
• Issued: 04/16/2002
• Est. Priority Date: 10/12/1999
• Status: Expired due to Term

• Current Assignee: FEI Company (Thermo Fisher Scientific Incorporated)
• Original Assignee: FEI Company (Thermo Fisher Scientific Incorporated)
• Inventors: Rasmussen, Jorgen
• Primary Examiner(s): Arroyo, Teresa M.
• Assistant Examiner(s): Fernandez, Kalimah
• Application Number:
  US09/415,644
• Time in Patent Office: 917 Days
• Field of Search: 250/492.21, 250/310, 250/306
• US Class Current: 250/492.21
• CPC Class Codes: H01J 37/228 whereby illumination or light collection take place in the same area of the discharge
• CPC Class Codes: H01J 37/3005 Observing the objects or the point of impact on the object
• CPC Class Codes: H01J 37/3056 for microworking, e. g. etching of gratings or trimming of electrical components

Abstract

An optical microscope has an optical axis that coincides with a focused ion beam. The optical microscope can be used to locate target features on a specimen for subsequent operations by the ion beam, thereby eliminating the need for complex and potentially inaccurate registration procedures. The optical microscope can use infrared light so that features on a silicon flip chip are observable through the silicon from the backside. The ion beam can then machine the chip to expose the features for subsequent operations.

Claims

1. An apparatus for positioning the impact point of a focused ion beam on a specimen, the apparatus comprising:

an ion source;

an ion column for focusing ions from the ion source into a beam for impinging on the specimen at a target point the ion column having an ion column axis;

and an optical microscope having an optical axis, the optical microscope and the ion column configured so that they are substantially coaxial as their axes approach the target point.

2. The apparatus of claim 1 in which the optical microscope includes a mirror positioned between the ion column and the specimen, the mirror reflecting light from the specimen for forming an image.

3. The apparatus of claim 2 in which the mirror is mounted on to the ion column.

4. The apparatus of claim 2 in which the mirror includes an aperture for passing the ion beam.

5. The apparatus of claim 1 further comprising an illumination source for illuminating the specimen.

6. The apparatus of claim 5 in which light from the illumination source approaches the specimen along the optical axis of the optical microscope.

7. The apparatus of claim 5 in which light from the illumination source approaches the specimen at a non-zero angle to the optical axis.

8. The apparatus of claim 5 in which the illumination source comprises one or more light emitting diodes.

9. The apparatus of claim 5 in which the specimen is positioned within a vacuum chamber and in which the illumination source is positioned within the vacuum chamber.

10. The apparatus of claim 5 in which the illumination source illuminates the specimen from two different directions, neither direction being along the optical axis.

11. The apparatus of claim 10 in which the two directions are rotationally spaced ninety degrees apart from each other and are oriented approximately 45 degree to the optical axis.

12. The apparatus of claim 5 in which the illumination source includes at least two light emitting diodes.

13. The apparatus of claim 5 in which the illumination source illuminates the specimen primarily in the infra-red wavelength.

14. The apparatus of claim 5 in which the illumination source illuminates the specimen primarily in the visible wavelength.

15. The apparatus of claim 2 in which the mirror reflects light to form a dark field image of the specimen.

16. The apparatus of claim 2 in which the mirror reflects light to form a bright field image of the specimen.

17. The apparatus of claim 1 further comprising a light source for optically processing the specimen through the optical microscope.

24. The apparatus of claim 1 in which the optical microscope includes an optical element positioned between the ion column and the specimen, the optical element reflecting light from the specimen for forming an image.

25. The apparatus of claim 1 in which the ion column includes an electrostatic objective lens.

18. A method of positioning the impact point of a focused ion beam at a target point on a specimen, the method comprising:

Providing an optical microscope having an optical axis and an ion column having column axis, the optical microscope and the ion column configured so that they are substantially coaxial as their axes approach the target point;

locating the target point using the optical microscope; and

directing the focused ion beam to target point.

19. The method of claim 18 in which locating a target point using an optical microscope includes illuminating the substrate and forming an image of the specimen using dark field illumination.

20. The method of claim 18 in which locating a target using an optical microscope includes locating a target point using infrared light transmitted through a layer of silicon to locate the target point.

21. The method of claim 18 in which locating a target using an optical microscope includes locating a target using visible light.

26. The method of claim 18 in which directing the focused ion beam to the target point includes focusing the ion beam using an electrostatic objective lens.

27. The method of claim 26 in which locating the target point using the optical microscope includes deflecting image-forming light from the sample away from the ion beam before the image-forming light passes through the electrostatic objective lens.

28. The method of claim 18 in which the specimen includes features having lines running primarily in two directions and in which the method further comprises illuminating the specimen from two directions that corresponds to the two primary directions of the lines.

22. A method of exposing an integrated circuit feature under a silicon layer, the method comprising:

illuminating an area including the feature through the layer of silicon using infrared light;

using dark field infrared light from the specimen collected from an optical path that is substantially coaxial with an ion beam column to form a image of the area;

locating the feature in the image; and

ion beam machining through the silicon layer to access the feature.

29. The method of claim 22 in which using dark field infrared light from the specimen collected from an optical path that is substantially coaxial with an ion beam column to form a image of the area includes directing the dark field infrared light away from an axis of the ion beam column for detection.

23. An apparatus for locating, exposing, and performing focused ion beam operations on features on an integrated circuit under a layer of silicon, comprising:

an ion source;

an ion column for focusing ions from the ion source into a beam for impinging on the specimen at a target point, the ion path defining an axis of the ion beam;

an infrared illumination source illumination

an optical microscope for viewing an infrared image of the specimen, the optical microscope having an optical axis that is substantially coaxial with the axis of the ion beam at the target point, the optical microscope thereby including the target of the ion column in its field of view.

30. The apparatus of claim 23 in which the optical microscope includes an optical element for directing the infrared light from the specimen away from the axis of the ion beam.