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Field-effect-controllable, vertical semiconductor component, and monolithically integrated half bridge

  • US 6,373,097 B1
  • Filed: 09/19/1997
  • Issued: 04/16/2002
  • Est. Priority Date: 09/19/1996
  • Status: Expired due to Term
First Claim
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1. A field-effect-controllable vertical semiconductor component, comprising:

  • a semiconductor body having;

    front and rear wafer sides;

    at least one drain region of a first conduction type;

    at least one source region of the first conduction type;

    at least one body region of a second conduction type between said at least one drain region and said at least one source region;

    said semiconductor body having at least one trench formed therein extending from said front wafer side into said at least one source region;

    at least one gate electrode formed in said at least one trench, projecting above said at least one trench and partially overlapping a region of said at least one drain region adjoining said at least one trench;

    a gate oxide formed on said front wafer side and in said at least one trench insulating said at least one gate electrode from said entire semiconductor body; and

    contact regions embedded in said at least one drain region spaced apart from said at least one trench, said contact regions having the same conduction type as said at least one drain region and having a higher dopant concentration than said at least one drain region;

    a gate terminal and a drain terminal disposed on said front wafer side; and

    a source terminal disposed on said rear wafer side.

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