Layout for a ball grid array

• US 6,373,139 B1
• Filed: 10/06/1999
• Issued: 04/16/2002
• Est. Priority Date: 10/06/1999
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Clark, Peggy L.
• Primary Examiner(s): Loke, Steven
• Assistant Examiner(s): THAI, LUAN C
• Application Number:
  US09/413,705
• Time in Patent Office: 923 Days
• Field of Search: 257/773, 257/774, 257/737, 257/738, 257/772, 257/779, 257/780, 257/784, 361/777
• US Class Current: 257/774
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A layout for a ball grid array (BGA) device (500) includes a set of solder ball pads (512) and a set of interconnection vias (510). Each one of said the set of interconnection vias (510) is coupled to a corresponding one of the solder ball pads (512). The interconnection vias (510) are laid out such that they provide for increased room for both vertical and horizontal traces (602, 702 and 802). With the BGA device (500) divided by an X-axis and a Y-axis to form four quadrants, two other axes V and W, are established rotated 45 degrees from the X and Y axes respectively. The solder pads (512) and interconnection vias (510) are on laid out on lines along or parallel to the V and W axes. The interconnection vias (510) in the four quadrants are located closer to the edge margins of the BGA device (500) than their corresponding solder ball pads (512).

Claims

1. A ball grid array device, comprising:

a substrate having a plurality of edge margins;

a plurality of solder ball pads located on the substrate;

a plurality of interconnection vias electrically coupled one each to a corresponding one of the plurality of solder ball pads; and

the substrate is divided into four uniformly aligned quadrants (1^st, 2^nd, 3^rd and 4^th quadrants) by an X-axis and a Y-axis that intersect at the middle of the substrate and that are orthogonal to each other, and each one of the plurality of solder ball pads and their corresponding interconnection vias form pairs and the pairs are laid out uniformly along a plurality of lines which are at 45 degree angles to either the X or Y axes, and each one of the plurality of interconnection vias is located closer to the edge margins than its corresponding solder ball pad such that a gap is formed between each quadrant to facilitate placement of a plurality of interconnection traces.

2. A ball grid array device as defined in claim 1, wherein the substrate is further sub-divided by two other axes, a V-axis and a W-axis which are rotated 45 degrees from the X and Y axes respectively, and the plurality of interconnection vias are laid out such that:

the interconnection vias from amongst the plurality of interconnection vias and their corresponding solder ball pads located in the 1^st and 3^rd quadrants are laid out in lines along or parallel to the V-axis; and

the interconnection vias from amongst the plurality of interconnection vias and their corresponding solder ball pads located in the 2^nd and 4^th quadrants are laid out in lines along or parallel to the W-axis.

3. A ball grid array as defined in claim 1, wherein the substrate comprises a multi-layer substrate.

4. A ball grid array device, comprising:

a substrate;

a plurality of solder ball pads located on the substrate;

a plurality of interconnection vias electrically coupled one each to a corresponding one of the plurality of solder ball pads; and

the plurality of interconnection vias and solder ball pads are uniformly laid out such that when an X-axis and Y-axis orthogonal to each other are drawn to divide the substrate into four uniformly aligned equal quadrants, all of the plurality of interconnection vias and their corresponding solder ball pads located in each of the quadrants are laid out such that each one of the plurality of interconnection vias and corresponding solder ball pad are laid out as pairs along lines that are parallel to each other and that are at 45 degree angles from either the X or Y axes, and each of the plurality of interconnection vias are located further from the intersection of the X and Y axes than their corresponding solder ball pads such that a gap is formed between each quadrant to facilitate placement of a plurality of interconnection traces.

5. A ball grid array device as defined in claim 4, wherein the substrate comprises a multi-layer substrate.

6. A ball grid device as defined in claim 4, wherein the substrate is further sub-divided by two other axes, a V-axis and a W-axis which are rotated 45 degrees from the X and Y axes respectively, and the plurality of interconnection vias are laid out such that:

the interconnection vias from amongst the plurality of interconnection vias and their corresponding solder ball pads located in the 1^st and 3^rd quadrants are laid out in pairs on lines along or parallel to the V-axis; and

the interconnection vias from amongst the plurality of interconnection vias and their corresponding solder ball pads located in the 2^nd and 4^th quadrants are laid out in pairs on lines along or parallel to the W-axis.