Integral design features for heatsink attach for electronic packages
First Claim
Patent Images
1. An electronic package assembly comprising:
- a substrate having a first surface and a second surface;
an integrated circuit chip having a top surface;
first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
encapsulating means for encapsulating the integrated circuit chip, the encapsulating means contacting at least a portion of the first surface of the substrate;
an orifice formed in a top portion of the encapsulating means, the orifice partially penetrating a surface of the encapsulating means;
heat dissipating means disposed on the top portion of the encapsulating means; and
second attaching means detachably coupled to the orifice, the second attaching means aligned with and separate from the heat dissipating means to maintain the heat dissipating means in contact with the top portion of the encapsulating means.
0 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method attaching a heatsink to a surface of an electronic package comprising a substrate, an integrated circuit chip attached to the surface of the substrate, an encapsulant encapsulating the integrated circuit chip and contacting at least a portion of the surface of the substrate, and an orifice formed in the top portion of the encapsulant to attach the heatsink to the surface of the electronic package. The heatsink may be attached and removed as desired to allow for package identification or rework.
-
Citations
19 Claims
-
1. An electronic package assembly comprising:
-
a substrate having a first surface and a second surface;
an integrated circuit chip having a top surface;
first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
encapsulating means for encapsulating the integrated circuit chip, the encapsulating means contacting at least a portion of the first surface of the substrate;
an orifice formed in a top portion of the encapsulating means, the orifice partially penetrating a surface of the encapsulating means;
heat dissipating means disposed on the top portion of the encapsulating means; and
second attaching means detachably coupled to the orifice, the second attaching means aligned with and separate from the heat dissipating means to maintain the heat dissipating means in contact with the top portion of the encapsulating means. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. An electronic package assembly comprising:
-
a substrate having a first surface and a second surface;
an integrated circuit chip having a top surface;
first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
an overmold formed on the top surface of the integrated circuit chip and on the first surface of the substrate for encapsulating the integrated circuit chip, the overmold contacting at least a portion of the first surface of the substrate;
a slot formed in a top portion of the overmold, the slot partially penetrating a surface of overmold;
heat dissipating means disposed on the top portion of the overmold, and second attaching means detachably coupled to the slot, the second attaching means aligned with and separate from the heat dissipating means to maintain the heat dissipating means in contact with the top portion of the overmold. - View Dependent Claims (12, 13, 14, 15, 16)
-
-
17. A method for packaging an electronic assembly comprising the steps of:
-
(a) attaching an integrated circuit chip to a first surface of a substrate using a first attachment, (b) encapsulating the integrated circuit chip using an encapsulant contacting the integrated circuit chip and at least a portion of the first surface of the substrate, and (c) forming a second attachment in a top portion of the encapsulant, the attachment partially penetrating the top portion of the encapsulant;
(d) detachably coupling a heat dissipator to the encapsulant using a third attachment; and
(e) disposing heat transfer means between the encapsulant and the heat dissipator.
-
-
18. An electronic package assembly comprising:
-
a substrate having a first surface and a second surface;
an integrated circuit chip having a top surface;
first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
an overmold formed on the top surface of the integrated circuit chip and on the first surface of the substrate for encapsulating the integrated circuit chip, the encapsulating means contacting at least a portion of the first surface of the substrate;
an orifice formed in a top portion of the overmold;
heat dissipating means disposed over the top portion of the overmold;
heat transfer means disposed between the heat dissipating means and the overmold; and
second attaching means detachably coupled to the orifice, the second attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top portion of the overmold.
-
-
19. An electronic package assembly comprising:
-
a substrate having a first surface and a second surface;
an integrated circuit chip having a top surface;
first attaching means for attaching the integrated circuit chip to the first surface of the substrate;
an overmold formed on the tope surface of the integrated circuit chip and on the first surface of the substrate for encapsulating the integrated circuit chip, the overmold contacting at least a portion of the first surface of the substrate;
a slot formed in a top portion of the overmold;
heat dissipating means disposed on the top portion of the overmold;
second attaching means detachably coupled to the overmold, the second attaching means aligned with the heat dissipating means and maintaining the heat dissipating means in contact with the top portion of the overmold; and
heat transfer means disposed between the heat dissipating means and the overmold.
-
Specification