High conductivity buried layer in optical waveguide

• US 6,374,001 B1
• Filed: 09/14/1999
• Issued: 04/16/2002
• Est. Priority Date: 03/20/1997
• Status: Expired due to Fees

• Current Assignee: Qinetiq Limited (QinetiQ Group PLC)
• Original Assignee: Secretary of State For Defence
• Inventors: Nayar, Vishal, Bozeat, Robert J
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): RAHLL, JERRY T
• Application Number:
  US09/380,982
• Time in Patent Office: 945 Days
• Field of Search: 385/4, 385/8, 385/39, 385/40, 385/41, 385/129, 385/130, 385/131, 385/132
• US Class Current: 385/8
• CPC Class Codes: G02F 1/025 in an optical waveguide structure G02F1/017, G02F1/2257 take precedence

Abstract

An optical device (300) comprises a multilayer structure, formed by wafer bonding, incorporating in sequence a silicon dioxide layer (304), a buried silicide layer (306), a contact layer (308) and a silicon surface layer (310). The surface layer (310) is selectively etched to form an exposed rib (312). An upper surface of the rib (312) is doped to form an elongate electrode (314) therealong. The surface layer (310) is selectively etched to the contact layer (308) in regions remote from the rib (312) to form via channels (316a, 316b) for making electrical connection to the contact layer (308). The rib (312) forms a waveguide along which radiation propagates. When the electrode (314) is biased relative to the contact layer (308), charge carriers are injected into the rib (312) and induce refractive index changes in a central region (324) thereof where most of the radiation propagates along the rib (312). The silicide layer (306) provides an efficient current conduction path for injecting the carriers, thereby providing enhanced device operating bandwidth and reduced power dissipation.

Claims

1. An optical device having an active region (108;

312;

408;

512) for radiation propagation and injecting means (110;

202, 204;

410, 414;

514, 520) for injecting charge carriers into the active region, characterised in that the injecting means incorporates a high conductivity buried layer (104;

202;

306, 308;

402;

506) between two wafer elements of a bonded wafer couplet and the device incorporates concentrating means (204;

414) between the buried layer and the active region for concentration of charge carriers in the active region.

2. A device according to claim 1, characterised in that the concentrating means (414) is a region of the buried layer (402) which projects through an insulating layer (404) extending between parts of the device.

3. A device according to claim 2, characterised in that the buried layer is a polysilicon layer (402).

4. A device according to claim 3, characterised in that the polysilicon layer (402) incorporates dopant impurity to a concentration in a range of 10¹⁸ to 10¹⁹ atoms cm⁻

3.

5. A device according to claim 1, characterised in that the concentrating means is a heavily doped region (204) of different chemical composition to the buried layer (202).

6. A device according to claim 5, characterised in that the heavily doped region (204) and the buried layer (202) share a like dopant impurity providing conductivity in the former.

7. A device according to claim 6, characterised in that the dopant impurity is thermally diffusable from the buried layer (202) to the heavily doped region (204).

8. A device according to claim 6 or 7, characterised in that the dopant impurity concentration in the heavily doped region is in a range of 10¹⁸ to 10¹⁹ atoms cm⁻

3.

9. A device according to claim 1, characterised in that the buried layer is a metal silicide layer (202).

10. A device according to claim 9, characterised in that the buried layer (202) is a tungsten silicide layer.

11. A device according to claim 9, characterised in that the buried layer (202) is any one of tantalum silicide layer, a cobalt silicide layer and a titanium silicide layer.

12. A device according to claim 1, characterised in that the buried layer (708) incorporates a chemical element of the wafer couplet (714) material.

13. A device according to claim 12, characterised in that the buried layer (202;

708) is a metal silicide and the wafer couplet material is silicon.

14. A device according to claim 1, characterised in that it incorporates a dielectric insulating layer (304;

504) for electrically isolating the active region, the buried layer, the injecting means and the concentrating means from other elements of the device.

15. A device according to claim 1, characterised in that the active region incorporates dopant impurity to a concentration to a concentration of less than 10¹⁶ atoms cm⁻

3.

16. An optical device according to claim 1, characterised in that the active region (108;

312;

407, 512) provides radiation waveguiding means with refractive index modulatable by the injecting means.

17. A device according to claim 1, characterised in that one of the wafer elements in the couplet provides the active region.

18. A device according to claim 1, characterised in that the concentrating means comprises a first electrode (110) located upon one side of the active region and the device includes a second electrode (204) located upon the other side.

19. A device according to claim 18, characterised in that the first electrode lies between the active region (108) and an insulating layer (102).

20. A device according to claim 1, characterised in that the active region provides radiation waveguiding means and the injecting means is arranged to modulate the refractive index of the waveguiding means by injecting charge carriers predominantly into regions thereof in which radiation predominantly propagates.

21. A device according to claim 1, characterised in that the buried layer (202) has a coefficient of resistivity of less than 1.5 μ

Ω

m.

22. A device according to claim 1, characterised in that the buried layer (202) has a coefficient of resistivity of less than 7.5 Ω

per square.

23. A device according to claim 1, characterised in that the buried layer incorporates at least one of holes, island and channels for relieving stress between it and a layer bonded to it.

24. A device according to claim 1, characterised in that the active region incorporates at least one of:

(i) gold doping; and

(ii) induced lattice defects, for reducing carrier lifetime and increasing recombination site density therein.

25. A method of fabricating an optical device including the steps of:

(a) providing first and second wafer elements (700, 702;

850, 856);

(b) providing the wafer elements with a layer structured (706, 708, 710;

854, 862, 858) to define injecting means for injecting charge carriers into an active device region for radiation propagation;

(c) providing one of the wafer elements with a metal silicide (708) or a polysilicon layer (862) to provide injecting means;

(d) bonding the wafer elements to form a wafer couplet (714;

866) within which the metal silicide layer or the polysilicon layer is buried; and

(e) processing the couplet (714;

866) to define the active device region.

26. A method according to claim 25 characterised in that, in step (b), the structured layer is an insulating layer (858) which is formed with a void (860) and, in step (c), the injecting means is formed to extend through the void (860).

27. A method according to claim 25, characterised in that the suicide layer comprises a tungsten silicide layer.

28. A method according to claim 25 wherein, in step (d), the wafer elements are thermally bonding by bringing them into contact with one another for a period and heating them to a temperature in a range of 800°

C. to 1200°

C. during the period.

29. A method according to claim 25, characterised in that the silicide layer (708) is selectively doped with dopant impurities which diffuse therefrom to an adjoining layer (706), thereby defining a conducting region (320b;

703) for concentrating charge carrier injection into the device active region (324;

724).

30. A method according to claim 25, characterised in that the device active region is at least one of gold doped or irradiated for increasing charge carrier recombination site density therein.

31. A method according to claim 25, characterised in that at least one of holes, island and channels are formed into the metal silicide layer for relieving stress between it and a layer bonded to it.