Waferless seasoning process
First Claim
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1. A waferless seasoning process used to season an etching chamber of an etching machine before an etching process is performed, the process comprising the step of:
- performing a dry cleaning process in the etching chamber with a plasma formed by oxygen and hydrogen bromide to restore an etching environment in the etching chamber, wherein the etching chamber is free of wafers while performing the dry cleaning process.
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Abstract
A waferless seasoning process is described, which waferless seasoning process is suitable for an etching chamber of an etching machine when the etching environment is so bad that etching cannot be performed. A dry cleaning process with a plasma formed by oxygen and hydrogen bromide is performed to restore the etching environment in the etching chamber.
11 Citations
20 Claims
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1. A waferless seasoning process used to season an etching chamber of an etching machine before an etching process is performed, the process comprising the step of:
performing a dry cleaning process in the etching chamber with a plasma formed by oxygen and hydrogen bromide to restore an etching environment in the etching chamber, wherein the etching chamber is free of wafers while performing the dry cleaning process. - View Dependent Claims (2, 3)
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4. A waferless seasoning process used to season an etching chamber of an etching machine to avoid the first wafer effect, the process comprising the steps of:
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performing a dry cleaning process in the etching chamber with a first plasma formed by oxygen and sulfonium hexafluoride, wherein the etching chamber is free of wafers while performing the dry cleaning process; and
performing an etching-chamber recovery process with a second plasma;
formed by hydrogen.- View Dependent Claims (5, 6, 7, 8)
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9. A process for cleaning an etching chamber of an etching machine before an etching process is performed, the process comprising the steps of:
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performing a waferless seasoning process in the etching chamber, wherein the etching chamber is free of wafers while performing the seasoning process, and the seasoning process using a plasma of oxygen and hydrogen bromide or a plasma of oxygen and sulfonium hexafluoride; and
performing at least a testing process until the etching environment in the etching chamber is restored. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification