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Method for laser scanning flip-chip integrated circuits

  • US 6,375,347 B1
  • Filed: 09/05/2000
  • Issued: 04/23/2002
  • Est. Priority Date: 11/04/1998
  • Status: Expired due to Fees
First Claim
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1. A method for analyzing temperature characteristics of an integrated circuit having a back side opposite a circuit side including suspect target circuitry, comprising:

  • directing a beam of laser light at the back side of the integrated circuit;

    using a test controller to power the integrated circuit with a source providing nonconstant current and nonconstant voltage and to exercise the suspect circuitry while the beam is being directed at the back side;

    in response to the steps of directing a beam of laser light and using a test controller to exercise the suspect circuitry, measuring at least one parameter responding to the suspect circuitry; and

    comparing said at least one parameter with a reference level, whereby a magnitude of difference between the reference level and said at least one parameter is indicative of a temperature characteristic of the suspect circuitry.

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