Mounting structure of semiconductor element

• US 6,376,906 B1
• Filed: 02/11/1998
• Issued: 04/23/2002
• Est. Priority Date: 02/12/1997
• Status: Expired due to Term

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ota, Shinji, Asai, Yasutomi, Nagasaka, Takashi
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Wille, Douglas A.
• Application Number:
  US09/021,989
• Time in Patent Office: 1,532 Days
• Field of Search: 257/698
• US Class Current: 257/698
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48235 connecting the wire to a via metallisation of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48639 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48647 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/48739 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48744 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48747 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/85385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/85439 : Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/85444 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/85447 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

In a mounting structure of a flip chip IC, the flip chip IC is mounted on an alumina laminated substrate through conductive lands of the substrate and bumps of the flip chip IC. A space between the flip chip IC and the substrate is filled with resin. Further, inspection lands are provided on the substrate for inspecting the flip chip IC, and are electrically connected to the conductive lands through vias and inside wires provided in the substrate. That is, the inspection lands are connected to the conductive lands to bypath an edge portion of the resin. As a result, separation of the resin from the substrate can be prevented.

Claims

1. A mounting structure of a semiconductor element, comprising:

a substrate having a substrate main surface;

a first land disposed on the substrate main surface;

a semiconductor chip having an electrode and mounted on the substrate main surface with the electrode electrically connected to the first land;

a resin member hermetically sealing the semiconductor chip and the first land in contact with the substrate main surface;

a second land disposed on the substrate main surface apart from an edge portion of the resin member on the substrate main surface;

first and second via-conductors provided vertically in the substrate, each of the via-conductors being located under a corresponding one of the first and second lands; and

an inside-wire provided laterally within a thickness of the substrate and not being exposed to an outer surface of the substrate, the inside-wire being connected to the first and second via-conductors, wherein;

the semiconductor chip is sealed only by the resin member; and

the first land is electrically connected to the second land via the first and second via-conductors and the inside-wire while bypassing the edge portion of the resin member.

2. The mounting structure of claim 1, further comprising a wire electrically connecting the electrode of the semiconductor chip and the first land, wherein the resin member hermetically seals the semiconductor chip, the first land, and the wire.

3. The mounting structure of claim 1, further comprising a third via-conductor extending vertically in the substrate, from a wiring node provided at a middle of the inside-wire, wherein an entirety of the third via-conductor is contained in the substrate and connected to another inside-wire in the substrate.

4. The mounting structure of claim 1, wherein the second land has a size larger than that of the first land.

5. The mounting structure of claim 4, wherein:

the first land is composed of a first plurality of lands;

the second land is composed of a second plurality of lands corresponding to the first plurality of lands, respectively; and

all of the second plurality of lands are larger than the first plurality of lands in size.

6. The mounting structure of claim 1, wherein:

the first land is composed of a first plurality of lands;

the second land is composed of a second plurality of lands; and

the inside-wire is composed of a plurality of inside-wires respectively connecting corresponding ones of the first plurality of lands and the second plurality of lands, wherein all of the plurality of inside-wires are provided inside the substrate at an approximately identical depth with one another from the substrate main surface.

7. The mounting structure of claim 6, wherein:

the substrate is composed of a plurality of laminated layers that includes an uppermost layer forming the substrate main surface; and

the plurality of inside-wires underlie the uppermost layer.

8. The mounting structure of claim 1, wherein:

the first land is composed of a first plurality of lands;

the second land is composed of a second plurality of lands equal in number to that of the first plurality of lands;

the inside-wire is composed of a plurality of inside-wires respectively provided in the substrate and each connecting a corresponding one of the first plurality of lands and a corresponding one of the second plurality of lands; and

the substrate main surface has no land between the corresponding one of the first plurality of lands and the corresponding one of the second plurality of lands.

9. The mounting structure of claim 1, wherein:

the substrate is a laminated substrate having the first and second via-conductors and the inside-wire; and

the inside-wire is sandwiched between two sintered insulating material layers of the laminated substrate.

10. The mounting structure of claim 1, wherein the first land is disposed on the first via-conductor with a center of the first land shifted from a center of the first via-conductor.

11. The mounting structure of claim 1, wherein:

the first land has a plurality of first land portions;

the second land has a plurality of second land portions equal in number to that of the plurality of first land portions; and

each of the plurality of first land portions is connected to a corresponding one of the plurality of second land portions while bypassing the edge portion of the resin member.

12. The mounting structure of claim 1, wherein the substrate has a surface portion which forms the substrate main surface and is made of one of alumina and glass.

13. The mounting structure of claim 1, wherein the resin member contains an epoxy resin.

14. The mounting structure of claim 13, wherein the resin member contains a filler.

15. The mounting structure of claim 14, wherein the filler is made of glass.

16. The mounting structure of claim 1, wherein the first land and the second land contain at least one selected from a group consisting of copper, silver, nickel, gold, platinum, palladium, tin, and aluminum.

17. The mounting structure of claim 1, wherein the resin member has a bottom face contacting the substrate main surface, and an externally exposed outer surface.

18. The mounting structure of claim 17, wherein the edge portion of the resin member is defined by the bottom face and the outer surface of the resin member.

19. The mounting structure of claim 1, wherein both the first land and the second land are disposed on the substrate main surface apart from the edge portion of the resin member.

20. The mounting structure of claim 1, wherein the resin member contains glass.

21. A mounting structure of a semiconductor element, comprising:

a substrate having a substrate main surface;

a first land disposed on the substrate main surface;

a semiconductor chip mounted on the substrate main surface and electrically connected to the first land at an electrical connection part;

a resin member hermetically sealing at least the electrical connection part between the first land and the semiconductor chip in contact with the substrate main surface;

a second land disposed on the substrate main surface apart from an edge portion of the resin member on the substrate main surface;

first and second via-conductors provided vertically in the substrate, each of the via-conductors being located under a corresponding one of the first and second lands; and

an inside-wire provided laterally within a thickness of the substrate and not being exposed to an outer surface of the substrate, the inside-wire being connected to the first and second via-conductors, wherein;

the edge portion of the resin member is exposed externally; and

the first land is electrically connected to the second land via the first and second via-conductors and the inside-wire while bypassing the edge portion of the resin member.

22. The mounting structure of claim 21, further comprising a bump disposed between the semiconductor chip and the first land and electrically connecting the semiconductor chip and the first land at the electrical connection part.

23. The mounting structure of claim 21, wherein a member that is directly disposed on the substrate main surface and simultaneously contacts the resin member is the first land exclusively.

24. The mounting structure of claim 21, further comprising a third via-conductor extending vertically in the substrate, from a wiring node provided at a middle of the inside-wire, wherein an entirety of the third via-conductor is contained in the substrate and connected to another inside-wire in the substrate.

25. The mounting structure of claim 24, wherein the second land has a size larger than that of the first land.

26. The mounting structure of claim 25, wherein:

the first land is composed of a first plurality of lands;

the second land is composed of a second plurality of lands corresponding to the first plurality of lands, respectively; and

all of the second plurality of lands are larger than the first plurality of lands in size.

27. The mounting structure of claim 21, wherein:

the first land is composed of a first plurality of lands;

the second land is composed of a second plurality of lands; and

the inside-wire is composed of a plurality of inside-wires respectively connecting corresponding ones of the first plurality of lands and the second plurality of lands, wherein;

all of the plurality of inside-wires are provided inside the substrate at an approximately identical depth with one another from the substrate main surface.

28. The mounting structure of claim 27, wherein:

the substrate is composed of a plurality of laminated layers that includes an uppermost layer forming the substrate main surface; and

the plurality of inside-wires underlie the uppermost layer.

29. The mounting structure of claim 21, wherein:

the first land is composed of a first plurality of lands;

the second land is composed of a second plurality of lands equal in number to that of the first plurality of lands;

the inside-wire is composed of a plurality of inside-wires respectively provided in the substrate and each connecting a corresponding one of the first plurality of lands and a corresponding one of the second plurality of lands; and

the substrate main surface has no land between the corresponding one of the first plurality of lands and the corresponding one of the second plurality of lands.

30. The mounting structure of claim 21, wherein:

the substrate is a laminated substrate containing the first and second via-conductors and the inside-wire; and

the inside-wire is sandwiched between two sintered insulating material layers of the laminated substrate.

31. The mounting structure of claim 21, wherein the first land is disposed on the first via-conductor with a center of the first land shifted from a center of the first via-conductor.

32. The mounting structure of claim 21, wherein:

the first land has a plurality of first land portions;

the second land has a plurality of second land portions equal in number to that of the plurality of first land portions; and

each of the plurality of first land portions is connected to a corresponding one of the plurality of second land portions while bypassing the edge portion of the resin member.

33. The mounting structure of claim 21, wherein the substrate has a surface portion which forms the substrate main surface and is made of one of alumina and glass.

34. The mounting structure of claim 21, wherein the resin member contains an epoxy resin.

35. The mounting structure of claim 34, wherein the resin member contains a filler.

36. The mounting structure of claim 35, wherein the filler is made of glass.

37. The mounting structure of claim 21, wherein the first land and the second land contains at least one selected from a group consisting of copper, silver, nickel, gold, platinum, palladium, tin, and aluminum.

38. The mounting structure of claim 21, wherein the resin member has a bottom face contacting the substrate main surface, and an externally exposed outer surface.

39. The mounting structure of claim 38, wherein the edge portion of the resin member exposed externally is defined by the bottom face and the outer surface of the resin member.

40. The mounting structure of claim 21, wherein both the first land and the second land are disposed on the substrate main surface apart from the edge portion of the resin member.

41. The mounting structure of claim 21, wherein the resin member contains glass.

42. The mounting structure of claim 21, wherein the resin member is positioned between the semiconductor and the substrate.