×

Heat pipe hinge structure for electronic device

  • US 6,377,452 B1
  • Filed: 12/17/1999
  • Issued: 04/23/2002
  • Est. Priority Date: 12/18/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. A heat pipe hinge structure for coupling a pair of housing portions of an electronic device to be opened and closed comprising:

  • a heat pipe hinge member made of a heat-conductive material, said heat pipe hinge member comprising a heat pipe hinge main body including a locating bore and a holding bore to securely hold one end portion of a second heat pipe to receive a heat through said second heat pipe from a heat generating component disposed in one of said pair of housing portions, and a heat pipe holding portion provided in said heat pipe hinge main body to pivotably hold at least a part of a first heat pipe disposed in other of said pair of housing portions, said heat pipe holding portion includes a heat pipe receptive groove for pivotably receiving said part of said first heat pipe, extended guiding portions, and a heat pipe fixing member having a pressing portion and latching portions made of elastic material to press said part of said first heat pipe received in said heat pipe receptive groove; and

    a hinge portion comprising a fixed hinge portion and a movable hinge portion to fix said heat pipe hinge member on at least one housing portion of said pair of housing portions and guide opening and closing of said pair of housing portions, said fixed hinge portion having a supporting shaft member being fixed thereon, said supporting shaft member being fitted in said locating bore, and said movable hinge portion including a cylindrical bearing portion in which said supporting shaft member is inserted.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×