Removable electromagnetic interference shield

• US 6,377,475 B1
• Filed: 02/26/2001
• Issued: 04/23/2002
• Est. Priority Date: 02/26/2001
• Status: Expired due to Term

• Current Assignee: W. L. Gore & Associates (W.L. Gore & Associates)
• Original Assignee: Gore Enterprise Holdings Incorporated (W.L. Gore and Associates)
• Inventors: Reis, Bradley E.
• Primary Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US09/793,754
• Time in Patent Office: 421 Days
• Field of Search: 361/799, 361/800, 361/801, 361/816, 361/818, 174/35.R, 174/51, 206/719
• US Class Current: 361/818
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: H05K 9/0035 with retainers mounted beforehand on the PCB, e.g. clips

Abstract

An EMI shielded apparatus having a substrate with at least one electrical component disposed on it; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a shield comprising a dielectric material layer having an inner surface and an outer surface and an electrically conductive layer over at least one of the inner and outer surface; a plurality of apertures formed in the shield such that the apertures correspond to the pattern of the electrically conductive fastening units; wherein at least one of the apertures has a contact region and wherein both the dielectric material layer and the electrically conductive layer of the shield at the contact region of the aperture are deflectable to the extent necessary to allow the contact region to engage and retain the electrically conductive fastening unit; and wherein the electrically conductive layer of the shield at the contact region is in electrical contact with the electrically conductive fastening unit.

Claims

1. An apparatus comprising:

(a) a substrate having at least one electrical component disposed thereon;

(b) a plurality of discrete electrically conductive fastening units disposed in a pattern on said substrate surrounding said at least one electrical component;

(c) an EMI shield comprising a dielectric material layer having an inner surface and an outer surface and an electrically conductive layer over at least one of said inner and outer surface;

(d) a plurality of apertures formed in said EMI shield such that said apertures correspond to said pattern of said electrically conductive fastening units;

(e) wherein at least one of said apertures has a contact region and wherein both said dielectric material layer and said electrically conductive layer of said EMI shield at said contact region of said aperture are deflectable to the extent necessary to allow said contact region to engage and retain at least one of said electrically conductive fastening units;

(f) and wherein said electrically conductive layer of said EMI shield at said contact region is in electrical contact with at least one said electrically conductive fastening unit.

2. An apparatus as defined in claim 1 wherein at least one of said electrically conductive fastening units is a solder sphere.

3. An apparatus as defined in claim 2 wherein said substrate has a ground trace disposed on it and at least one said solder sphere is soldered to said ground trace on said substrate.

4. An apparatus as defined in claim 3 wherein at least one said solder sphere is in interference contact with said contact region of said EMI shield.

5. An apparatus as defined in claim 1 wherein said electrically conductive layer is disposed on said outer surface of said dielectric material layer.

6. An apparatus as defined in claim 5 wherein said electrically conductive layer is selected from the group consisting of aluminum, tin, gold, nickel, silver, copper and combinations and alloys thereof.

7. An apparatus as defined in claim 1 wherein said electrically conductive layer is foil.

8. An apparatus as defined in claim 1 wherein said electrically conductive layer is formed by a process selected from the group of sputtering, vacuum or vapor deposition, electroless plating, and electrolytic plating.

9. An apparatus as defined in claim 1 wherein said substrate has a plurality of electrical components and said EMI shield further comprises a plurality of compartments adapted to cover said plurality of electrical components.

10. An apparatus as defined in claim 1 wherein said aperture is formed as said electrically conductive fastening unit penetrates said EMI shield.

11. An EMI shield for a substrate having at least one electrical component disposed thereon and a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electronic component, said EMI shield comprising:

(a) a dielectric material layer having an inner surface and an outer surface;

(b) an electrically conductive layer over at least one of said inner and outer surface;

(c) a plurality of apertures formed in said shield such that said apertures correspond to the pattern of the electrically conductive fastening units;

(d) wherein at least one of said apertures has a contact region and wherein both said dielectric material layer and said electrically conductive layer of said shield at said contact region of said aperture are deflectable to the extent necessary to allow said contact region to engage and retain at least one of said electrically conductive fastening units; and

(e) wherein said electrically conductive layer of said EMI shield at said contact region is in electrical contact with at least one said electrically conductive fastening unit.

12. An EMI shield as defined in claim 11 wherein said electrically conductive layer is disposed on said outer surface of said dielectric material layer.

13. An EMI shield as defined in claim 12 wherein said electrically conductive layer is selected from the group consisting of aluminum, tin, gold, nickel, silver, copper and combinations and alloys thereof.

14. An EMI shield as defined in claim 11 wherein said electrically conductive layer is foil.

15. An EMI shield as defined in claim 11 wherein said electrically conductive layer is formed by a process selected from the group of sputtering, vacuum or vapor deposition, electroless plating, and electrolytic plating.

16. An EMI shield as defined in claim 11 wherein said substrate has a plurality of electrical components and said shield further comprises a plurality of compartments adapted to cover said plurality of electrical components.

17. An EMI shield as defined in claim 11 wherein at least one of said apertures is formed as at least one of said electrically conductive fastening units penetrates said EMI shield.

18. An apparatus comprising:

(a) a substrate having at least one electrical component disposed thereon;

(b) a plurality of discrete electrically conductive fastening units disposed in a pattern on said substrate surrounding said at least one electrical component;

(c) an EMI shield consisting essentially of an electrically conductive material;

(d) a plurality of apertures formed in said EMI shield such that said apertures correspond to said pattern of said electrically conductive fastening units;

(e) wherein at least one of said apertures has a contact region and wherein said electrically conductive material of said EMI shield at said contact region is deflectable to the extent necessary to allow said contact region to engage and retain at least one of said electrically conductive fastening units;

(f) and wherein said electrically conductive material of said EMI shield at said contact region is in electrical contact with at least one said electrically conductive fastening unit.

19. An apparatus as defined in claim 18 wherein at least one of said electrically conductive fastening units is a solder sphere.

20. An apparatus as defined in claim 19 wherein said substrate has a ground trace disposed on it and said at least one solder sphere is soldered to said ground trace on said substrate.

21. An apparatus as defined in claim 20 wherein said at least one solder sphere is in interference contact with said contact region of said EMI shield.

22. An apparatus as defined in claim 18 wherein said electrically conductive layer is selected from the group consisting of aluminum, tin, gold, nickel, silver, copper and combinations and alloys thereof.

23. An apparatus as defined in claim 18 wherein said electrically conductive layer is foil.

24. An apparatus as defined in claim 18 wherein said electrically conductive layer is formed by a process selected from the group of sputtering, vacuum or vapor deposition, electroless plating, and electrolytic plating.

25. An apparatus as defined in claim 18 wherein said substrate has a plurality of electrical components and said EMI shield further comprises a plurality of compartments adapted to cover said plurality of electrical components.

26. An apparatus as defined in claim 18 wherein at least one of said apertures is formed as at least one of said electrically conductive fastening units penetrates said EMI shield.

27. An apparatus as defined in claim 18 wherein said electrically conductive material is a dielectric material containing conductive particles.

28. An apparatus comprising:

(a) a substrate having at least one electrical component disposed thereon;

(b) a plurality of solder spheres disposed on said substrate surrounding said at least one electrical component;

(c) an EMI shield comprising at least one compartment adapted to cover said at least one electrical component, said EMI shield further comprising a dielectric material layer having an inner surface and an outer surface and an electrically conductive layer over at least one of said inner and outer surface; and

(d) wherein said electrically conductive layer of said EMI shield is in electrical contact with at least one of said solder spheres, and wherein said EMI shield and said solder spheres combine to limit electromagnetic radiation from entering or exiting said at least one compartment.