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Method and apparatus for monitoring material removal tool performance using endpoint time removal rate determination

  • US 6,379,980 B1
  • Filed: 07/26/2000
  • Issued: 04/30/2002
  • Est. Priority Date: 07/26/2000
  • Status: Active Grant
First Claim
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1. A method for monitoring the performance of a material removal tool, comprising:

  • providing a wafer having at least one process layer formed thereon;

    measuring the thickness of the process layer;

    removing at least a portion of the process layer in the material removal tool until an endpoint of the removal process is reached;

    determining a removal rate based on the measured thickness of the process layer and a duration of the removal process until the endpoint is reached; and

    comparing the determined removal rate to an expected removal rate to monitor the performance of the material removal tool.

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