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Pre-release plastic packaging of MEMS and IMEMS devices

  • US 6,379,988 B1
  • Filed: 05/16/2000
  • Issued: 04/30/2002
  • Est. Priority Date: 05/16/2000
  • Status: Expired due to Term
First Claim
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1. A method for activating at least one sensitive area of a microelectronic device, comprising:

  • providing a microelectronic device comprising a sensitive area disposed on a substrate, wherein the sensitive area comprises an inner surface facing towards the substrate and an outer surface facing away from the substrate; and

    wherein the microelectronic device further comprises a layer of electrically insulating material disposed on and touching said outer surface of the sensitive area, wherein the outer surface of the sensitive area is covered and protected by the electrically insulating material; and

    then perforating a sufficient amount of the layer of electrically insulating material to expose at least part of the outer surface of the sensitive area to the surrounding environment by using a non-ablative material removal process to selectively remove some, but not all, of the layer of electrically insulating material;

    whereby said at least part of the outer surface of the sensitive area becomes activated by exposing said at least part of the outer surface of the sensitive area to the surrounding environment.

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