Electrode terminal connection structure of semiconductor module

• US 6,380,617 B1
• Filed: 09/03/1999
• Issued: 04/30/2002
• Est. Priority Date: 09/08/1998
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
• Original Assignee: Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
• Inventors: Nagase, Toshiaki, Fukatsu, Toshinari, Yoshiyama, Hiromitsu, Sofue, Kenichi
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US09/389,329
• Time in Patent Office: 970 Days
• Field of Search: 257/723, 257/724, 257/691, 257/735, 257/787, 257/694, 257/695, 257/706, 361/792, 361/794, 361/704, 361/707
• US Class Current: 257/691
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

The side of one of the source electrodes 7a and 7b of two semiconductor modules Q1 and Q2 corresponding to a pair of upper and lower arms are installed parallel with the outer side of the other source electrode inside packages 8a and 8b. Both the modules are arranged parallel to one another in such a way that both the sides are opposed, an inter-module electrode terminal 15 for connecting the source electrode 7a of the module Q1 and the drain electrode (base substrate) 6b of the module Q2 is formed in a block shape, and one end of the inter-module electrode terminal 15 is vertically installed parallel and close to the side of the source electrode 7b on the base substrate of the module Q2. A positive electrode terminal 12 made of a block of a conductive metal is vertically installed so as to be electrically connected with both the base substrate 6a of the module Q1 and the lower positive electrode 10 of a bus electrode panel 5 parallel and close to the side of the source electrode 7a and to mechanically support the bus electrode panel 5.

Claims

1. An electrode terminal connection structure of a semiconductor module for connecting a non-insulated semiconductor module in which a conductive base structure is also used as an electrode for inputting main current, to a dual inverter structure, wherein:

an electrode terminal for inputting main current from outside the semiconductor module to the base substrate as an electrode for inputting main current is vertically installed on the base substrate in such a way that the electrode terminal is parallel with and close to an electrode terminal for outputting main current vertically installed inside a package of the semiconductor module, and current flows in opposite directions in two parallel and closely located portions,

said electrode terminal for outputting main current is located in parallel with and close to a side of a package; and

said electrode terminal for inputting main current is formed in a block shape which has depth from an edge of a substrate to a side of a package.

2. The electrode connection structure of a semiconductor module according to claim 1, wherein the electrode terminal formed in a block shape is secured to the base substrate with a screw passing through a top of the electrode terminal to the base substrate.