Loop heat pipe for mobile computers

• US 6,381,135 B1
• Filed: 03/20/2001
• Issued: 04/30/2002
• Est. Priority Date: 03/20/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Payne, Dave, Prasher, Ravi
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/814,078
• Time in Patent Office: 406 Days
• Field of Search: 361/698, 361/700, 257/714, 257/715, 174/15.1, 174/15.2, 165/80.4, 165/104.26
• US Class Current: 361/700
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops

Abstract

A heat transfer device for a mobile computer system using a loop heat pipe, the evaporator of the loop heat pipe coupled to the processor die. The vapor space and liquid space are separated. The separation of the vapor space, and the wick structure of the liquid space, ensures that the vapor space will not be distorted or clogged by the wick structure. The heat transfer device can be bent to meet design criteria without distorting the width or radius of the vapor space. In one embodiment of the present invention the evaporator, condenser, and liquid space have different types of wick structure. Another embodiment of the present invention, the vapor space of the loop heat pipe has uniform thickness. The loop heat pipe device of the present invention provides reduced evaporator and condenser resistance and increased burn out flux, thereby increasing the power handling capacity of the device.

Claims

1. A device comprising:

a die of a computer processor; and

a loop heat pipe coupled to the die, the loop heat pipe having an evaporator coupled to the die;

the evaporator having a first wick structure such that heat emanating from the die evaporates liquid in the first wick structure causing the die to cool;

a vapor space for transferring the vapor from the evaporator to a condenser, the condenser having a second wick structure; and

a liquid space, having a third wick structure, for transferring liquid from the condenser to the evaporator.

2. The device of claim 1, wherein the vapor space is a copper tube of uniform cross-sectional area.

3. The device of claim 1, wherein the condenser has fins to dissipate heat.

4. The device of claim 3, wherein the vapor space has fins to dissipate heat.

5. The device of claim 1, wherein the first wick structure, the second wick structure and the third wick structure comprise porous copper.

6. The device of claim 5, wherein the first wick structure and the second wick structure have higher porosity than the third wick structure.

7. The device of claim 1, wherein the first wick structure and the second wick structure have lower thermal resistance than the third wick structure.

8. The device of claim 5, wherein the third wick structure has a higher pumping capacity than the first wick structure.

9. A method comprising:

coupling a die of a computer processor to a loop heat pipe such that heat is removed from the die and remotely ejected, the loop heat pipe having;

an evaporator coupled to the die;

the evaporator having a first wick structure such that heat emanating from the die evaporates liquid in the first wick structure causing the die to cool;

a vapor space for transferring the vapor from the evaporator to a condenser, the condenser having a second wick structure; and

a liquid space, having a third wick structure, for transferring liquid from the condenser to the evaporator.

10. The method of claim 9, wherein the vapor space is a copper tube of uniform cross-sectional area.

11. The method of claim 9, wherein the condenser has fins to dissipate heat.

12. The method of claim 11, wherein the vapor space has fins to dissipate heat.

13. The method of claim 9, wherein the first wick structure, the second wick structure and the third wick structure comprise porous copper.

14. The method of claim 13, wherein the first wick structure and the second wick structure have higher porosity than the third wick structure.

15. The method of claim 9, wherein the first wick structure and the second wick structure have lower thermal resistance than the third wick structure.

16. The method of claim 13, wherein the third wick structure has a higher pumping capacity than the first wick structure.

17. An apparatus comprising:

a heat loop pipe having an evaporator with a first wick structures, a liquid space with a second wick structure, and a condenser having a third wick structure.

18. The apparatus of claim 17, wherein the first wick structure and the second wick structure are comprised of porous copper, the first wick structure having different porosity than the second wick structure.

19. The apparatus of claim 17, wherein the first wick structure and the third wick structure are comprised of porous copper, the first wick structure having different porosity than the third wick structure, and the second wick structure is comprised of cooper mesh.