Sensor and method of producing the same

• US 6,382,030 B1
• Filed: 11/11/1999
• Issued: 05/07/2002
• Est. Priority Date: 03/12/1998
• Status: Expired due to Term

• Current Assignee: Yamatake Corporation
• Original Assignee: Yamatake Corporation
• Inventors: Masuda, Takashi, Ishikura, Yoshiyuki, Kihara, Takashi
• Primary Examiner(s): Kwok, Helen
• Application Number:
  US09/423,933
• Time in Patent Office: 908 Days
• Field of Search: 735/143.2, 735/140.1, 737/18, 737/24, 737/06, 737/56, 361/283.1, 361/283.3, 361/283.4
• US Class Current: 73/718
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/0558 being stacked
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05669 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0104 : Zirconium [Zr]
• CPC Class Codes: H01L 2924/01041 : Niobium [Nb]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0106 : Neodymium [Nd]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/30105 : Capacitance

Abstract

Pads 24 and 25 to be bonded to connection members are formed at positions where the pads face electrode extraction holes 4a to 4c. A bonding agent 12 low in wettability for the surfaces of electrodes 1 and 3 is used. The bonding agent 12 and high-wettability material form the surfaces of the pads 24 and 25. This can firmly bond the connection members to the electrodes 1 and 3, and can prevent the electrodes 1 and 3 from short-circuiting.

Claims

1. A sensor comprising:

a sensor main body in which a cavity which communicates with outside through at least one electrode extraction hole is formed;

a first electrode arranged in the cavity to face a second electrode;

at least one connection member inserted in the cavity through the electrode extraction hole; and

at least one pad formed in the cavity and disposed between said connection member and one of said first and second electrodes, said connection member to electrically couple to said one of said first and second electrodes via said pad, said pad to face the electrode extraction hole, and bonded to said connection member, and made of a conductive material, wherein wettability of said connection member for a surface of said pad is higher than wettability of said connection member for a surface of each of said electrode.

2. A sensor according to claim 1, wherein said pad is formed on each of said surface of each of said electrodes at a position where said electrode faces the electrode extraction hole, and said electrode is connected to said connection member through said pad.

3. A sensor according to claim 2, wherein said connection member comprises:

a connection pin inserted through the cavity from the electrode extraction hole; and

a bonding agent for bonding said connection pin to said pad.

4. A sensor according to claim 3, wherein the bonding agent is made of Sn—

Ag, the surface of each of said electrodes is made of Pt, and the surface of said pad is made of Au.

5. A sensor according to claim 1, wherein said pad is located at a first side of an inner surface of said sensor main body, said first side opposite said electrode extraction hole, said inner surface forming the cavity, said pad facing the electrode extraction hole, and each of said electrodes located at a second side of said inner surface, said second side opposite said pad, each of said electrodes to contact said connection member.

6. A sensor according to claim 5, wherein said connection member comprises:

a connection pin inserted into the cavity from the electrode extraction hole; and

a bonding agent for bonding said connection pin to said pad.

7. A sensor according to claim 6, wherein the bonding agent is made of Sn—

Ag, the surface of each of said electrodes is made of Pt, and the surface of said pad is made of Au.

8. A sensor according to claim 1, wherein said connection member is made of solder for filling a space above said pad in the cavity.

9. A sensor according to claim 8, wherein the solder is made of Sn—

Ag, the surface of each of said electrodes is made of Pt, and the surface of said pad is made of Au.

10. A sensor according to claim 8, wherein the electrode extraction hole is tapered to decrease an inner diameter from an outer surface to an inner surface of said sensor main body.

11. A sensor according to claim 8, wherein at least part of an inner surface of the electrode extraction hole is covered with a material having high wettability for the solder.