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Process for depositing a tungsten-based and/or molybdenum-based layer on a rigid substrate, and substrate thus coated

  • US 6,383,566 B1
  • Filed: 06/30/2000
  • Issued: 05/07/2002
  • Est. Priority Date: 06/30/1999
  • Status: Expired due to Fees
First Claim
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1. A process for depositing at least one metal layer based on tungsten or molybdenum directly on a non-conductive substrate, which comprises providing at least one tungsten- or molybdenum-containing precursor in the form of a metal halide or an organometallic compound and at least one reducing agent and forming the at least one metal layer from the tungsten- or molybdenum-containing precursor and at least one reducing agent by chemical vapor deposition.

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