IC package having a conductive material at least partially filling a recess

• US 6,383,835 B1
• Filed: 08/30/1996
• Issued: 05/07/2002
• Est. Priority Date: 09/01/1995
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Komori, Hisatane, Kosaka, Tadashi, Hata, Fumio
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US08/707,046
• Time in Patent Office: 2,076 Days
• Field of Search: 257/81, 257/432, 257/433, 257/459, 257/774, 257/787, 257/730, 257/788, 257/698, 361/760, 361/767, 361/768, 361/737, 361/772, 438/64, 438/65, 438/113, 438/127, 438/667
• US Class Current: 438/65
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 : adapted for surface mounting

Abstract

An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.

Claims

1. A method of producing an IC package comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting a plurality of IC chips spacedly apart from each other on a surface of the substrate and electrically connecting each of the plurality of IC chips to a corresponding one of the conductive portions in the plurality of through-holes;

applying to the surface of the substrate a resin for encapsulating the plurality of IC chips with the through-holes being closed;

arranging a rigid plate member above the plurality of IC chips with the resin between the member and the surface of the substrate;

curing the resin after the arranging step; and

cutting the substrate together with the member and the cured resin so as to part the through-hole.

2. The method according to claim 1, wherein the cured resin and the member are light-transmissive and the plurality of IC chips are optically active elements each having a light receiving portion or light emitting portion.

3. The method according to claim 2, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

4. The method according to claim 1, wherein an insulating film is provided so as to cover an opening of the through-hole at the surface of the substrate to close the through-hole.

5. The method according to claim 1, wherein the through-hole is filled with a conductive material to close the through-hole.

6. A method of producing an IC package comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting a plurality of IC chips spacedly apart from each other on a surface of the substrate and electrically connecting each of the plurality of IC chips to a corresponding one of the conductive portions in the plurality of through-holes;

applying to the surface of the substrate a resin for encapsulating the plurality of IC chips with the through-holes being closed;

arranging a rigid plate member above the plurality of IC chips with the resin between the member and the surface of the substrate;

curing the resin after the arranging step; and

cutting the substrate together with the member and the cured resin to provide a plurality of discrete sections each having one of the plurality of IC chips.

7. The method according to claim 6, wherein the cured resin and the member are light-transmissive and the plurality of IC chips are optically active elements each having a light receiving portion or light emitting portion.

8. The method according to claim 7, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

9. The method according to claim 6, wherein an insulating film is provided on an opening of the through-hole at the surface of the substrate to close the through-hole.

10. The method according to claim 6, wherein the through-hole is filled with a conductive material to close the through-hole.

11. A method of producing an IC package comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting a plurality of IC chips spacedly apart from each other on a surface of the substrate and electrically connecting each of the plurality of IC chips to a corresponding one of the conductive portions in the plurality of through-holes;

applying to the surface of the substrate a resin for encapsulating the plurality of IC chips;

arranging a rigid plate member above the plurality of IC chips with the resin between the member and the surface of the substrate;

curing the resin after the arranging step; and

cutting the substrate together with the member and the cured resin so as to part the through-hole.

12. The method according to claim 11, wherein the cured resin and the member are light-transmissive and the plurality of IC chips are optically active elements each having a light receiving portion or light emitting portion.

13. The method according to claim 12, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

14. The method according to claim 11, wherein an insulating film is provided on an opening of the through-hole at the surface of the substrate to close the through-hole.

15. The method according to claim 11, wherein the through-hole is filled with a conductive material to close the through-hole.

16. A method of producing an IC package comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting an IC chip on a surface of the substrate and electrically connecting the IC chip to the conductive portion in the through-hole;

applying to the surface of the substrate a resin for encapsulating the IC chip with the through-hole being closed;

arranging a rigid plate member above the IC chip with the resin between the member and the surface of the substrate;

curing the resin after the arranging step; and

cutting the substrate together with the member and the cured resin at the through-hole.

17. The method according to claim 16, wherein the cured resin and the member are light-transmissive and the plurality of IC chips are optically active elements each having a light receiving portion or light emitting portion.

18. The method according to claim 17, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

19. The method according to claim 16, wherein an insulating film is provided on an opening of the through-hole at the surface of the substrate to close the through-hole.

20. The method according to claim 16, wherein the through-hole is filled with a conductive material to close the through-hole.

21. A method of producing an IC package with an optically active element comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting a plurality of optically active elements spacedly apart from each other on a surface of the substrate and electrically connecting each of the plurality of optically active elements to a corresponding one of the conductive portions in the plurality of through-holes;

applying to the surface of the substrate a light-transmissive resin for encapsulating the plurality of optically active elements with the through-holes being closed;

arranging a light-transmissive, rigid plate member above the plurality of optically active elements with the light-transmissive resin between the light-transmissive member and the surface of the substrate;

curing the light-transmissive resin after the arranging step; and

cutting the substrate together with the light-transmissive member and the cured light-transmissive resin so as to part the through-hole.

22. The method according to claim 21, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

23. The method according to claim 21, wherein an insulating film is provided on an opening of the through-hole at the surface of the substrate to close the through-hole.

24. The method according to claim 21, wherein the through-hole is filled with a conductive material to close the through-hole.

25. A method of producing an IC package with an optically active element comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting an optically active element on a surface of the substrate and electrically connecting the optically active element to the conductive portion in the through-hole;

applying to the surface of the substrate a light-transmissive resin for encapsulating the optically active element;

arranging a light-transmissive rigid plate member above the optically active element with the light-transmissive resin between the light-transmissive member and the surface of the substrate;

curing the light-transmissive resin after the arranging step; and

cutting the substrate together with the light-transmissive member and the cured light-transmissive resin.

26. The method according to claim 25, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

27. The method according to claim 25, wherein an insulating film is provided on an opening of the through-hole at the surface of the substrate to close the through-hole.

28. The method according to claim 25, wherein the through-hole is filled with a conductive material to close the through-hole.

29. A method of producing an IC package comprising the steps of:

preparing a substrate having formed therein a plurality of through-holes each having a conductive portion therein;

mounting an IC chip on a surface of the substrate and electrically connecting the IC chip to the conductive portion in the through-hole;

applying to the surface of the substrate a resin for encapsulating the IC chip;

arranging a rigid plate member above the IC chip with the resin between the member and the surface of the substrate;

curing the resin after the arranging step; and

cutting the substrate together with the cured resin.

30. The method according to claim 29, wherein the cured resin and the member are light-transmissive and the plurality of IC chips are optically active elements each having a light receiving portion or light emitting portion.

31. The method according to claim 30, wherein the optically active element is one selected from an optical sensor, a semiconductor laser or an LED.

32. The method according to claim 29, wherein an insulating film is provided on an opening of the through-hole at the surface of the substrate to close the through-hole.

33. The method according to claim 29, wherein the through-hole is filled with a conductive material to close the through-hole.