Article comprising vertically nano-interconnected circuit devices and method for making the same
First Claim
1. A method of making a circuit device comprising:
- providing a substrate;
growing a plurality of spaced-apart carbon nanotubes attached on the substrate so that each one of the plurality of nanotubes has a first exposed end and a second end attached to the substrate;
while the nanotubes are attached to the substrate, equalizing the length of the nanotubes so that each one of the plurality of nanotubes is substantially equal in length with a length variation of less than 20%;
bonding the resulting exposed ends of the plurality of nanotubes to a first circuit layer; and
removing the substrate to provide a circuit device having the plurality of nanotubes bonded to the first circuit layer with the second ends of the plurality of nanotubes exposed.
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Abstract
A circuit device is disclosed comprising at least two circuit layers or circuit devices vertically interconnected with a plurality of parallel and substantially equi-length nanowires disposed therebetween. The nanowires may comprise composites, e.g., having a heterojunction present along the length thereof, to provide for a variety of device applications. Also disclosed is a method for making the circuit device comprising growing a plurality of nanowires on a dissolvable or removable substrate, equalizing the length of the nanowires (e.g., so that each one of the plurality of nanowires is substantially equal in length), transferring and bonding exposed ends of the plurality of nanowires to a first circuit layer; and removing the dissolvable substrate. The nanowires attached to the first circuit layer then can be further bonded to a second circuit layer to provide the vertically interconnected circuit device.
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Citations
14 Claims
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1. A method of making a circuit device comprising:
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providing a substrate;
growing a plurality of spaced-apart carbon nanotubes attached on the substrate so that each one of the plurality of nanotubes has a first exposed end and a second end attached to the substrate;
while the nanotubes are attached to the substrate, equalizing the length of the nanotubes so that each one of the plurality of nanotubes is substantially equal in length with a length variation of less than 20%;
bonding the resulting exposed ends of the plurality of nanotubes to a first circuit layer; and
removing the substrate to provide a circuit device having the plurality of nanotubes bonded to the first circuit layer with the second ends of the plurality of nanotubes exposed. - View Dependent Claims (2, 3, 4, 7, 8, 9, 10, 11, 12, 13, 14)
partially embedding the plurality of nanowires attached to the dissolvable substrate in a layer of sacrificial material of substantially uniform thickness whereby an extra length of nanowires protrudes from the sacrificial material;
removing the extra length of nanowires; and
removing the sacrificial material.
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12. The method of claim 11, further comprising a conductive underlayer interposed between the dissolvable substrate and the catalytic nucleation layer for use in enhancing adherence of the layer of sacrificial material to the dissolvable substrate.
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13. The method of claim 11, in which the sacrificial material is deposited by electroplating.
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14. The method of claim 11, in which the thickness of the layer of sacrificial material is in the range of about 1 to 100 micrometers.
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5. A method of making a circuit device comprising:
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providing a dissolvable substrate growing a plurality of nanowires on the substrate so that each one of the plurality of nanowires has a first exposed end and a second end attached to the substrate, said growing the plurality of nanowires comprises depositing a catalytic nucleation layer on the dissolvable substrate and decomposing a gas adjacent the catalytic nucleation layer;
equalizing the length of the nanowires so that each one of the plurality of nanowires is substantially equal in length;
bonding the resulting exposed ends of the plurality of nanowires to a first circuit layer; and
removing the substrate to provide a circuit device having a plurality of nanowires bonded to the first circuit layer with the second ends of the plurality of nanowires exposed. - View Dependent Claims (6)
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Specification