Heterogeneous multi-lamination microstrip antenna

• US 6,384,785 B1
• Filed: 05/28/1996
• Issued: 05/07/2002
• Est. Priority Date: 05/29/1995
• Status: Expired due to Term

• Current Assignee: Nippon Telegraph and Telephone Corporation
• Original Assignee: Nippon Telegraph and Telephone Corporation
• Inventors: Tokumitsu, Tsuneo, Kamogawa, Kenji
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US08/653,907
• Time in Patent Office: 2,170 Days
• Field of Search: H01/Q.138, H01/Q 1.308, 343/700.MS, 343/873
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 15/0006 Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices H01Q15/12, H01Q15/22, H01Q15/24 take precedence

Abstract

A multifrequency-band microstrip antenna, for use in microwave to millimeter-wave band, is provided with different thicknesses of dielectric films to optimized the performance in any operating frequencies desired. In a double lamination antena substrate, for example, lamination 1 is made up of a number of dielectric films having a given dielectric constant and thickness, and lamination 2 is made up of a number of dielectric films of another given dielectric constant and thickness. An radiation element is provided between the films in lamination 2, and a ground plane is provided between the films in lamination 1. A strip conductor for propagating radio signals is provided in lamination 1 such that the ground plane intervenes between the radiation element and the strip conductor, thereby shielding the radiation element except for a slot formed in the ground plane. The input signal couples to the radiation element through the slot, thereby feeding the radiation element and operating the microstrip antenna.

Claims

1. A multi-lamination microstrip antenna comprising:

a plurality of dielectric laminations comprising a plurality of stacked dielectric film members, each dielectric film member having a selected dielectric constant and a selected film thickness, wherein the selected dielectric constant and the selected film thickness are the same with regard to the dielectric film members in the same dielectric lamination, and different with regard to the dielectric film members in different dielectric laminations;

a radiation element in contact with a film surface of a first dielectric film member disposed in a first lamination; and

a ground film member, which functions as a ground conductor of said radiation element, in contact with a film surface of a second dielectric film member disposed in a second lamination, wherein said ground film member forms a ground plane.

2. A microstrip antenna, as claimed in claim 1, comprising:

a high frequency signal line, disposed opposite to said radiation element with said ground plane intervening between said high frequency signal line and said radiation element, wherein said high frequency signal line is in contact with a film surface of a dielectric film member in a lamination; and

a slot formed on said ground film member for receiving input signals into said radiation element so as to enable said input signals to couple with said radiation element in accordance with the electromagnetic field generated by said high frequency signal line to drive said radiation element.

3. A microstrip antenna, as claimed in claim 1, comprising:

a high frequency signal line, disposed opposite to said radiation element with said ground plane intervening between said high frequency signal line and said radiation element, wherein said high frequency signal line is in contact with a film surface of a dielectric film member in a lamination;

a slot formed on said ground film member; and

a conductor member for operatively connecting an end of said high frequency signal line with said radiation element, so as to produce a direct electrical connection to drive said radiation element.

4. A microstrip antenna as claimed in claim 3, wherein said conductor member is an open ended cavity termed a via-hole.

5. A microstrip antenna as claimed in one of claims 1 to 4, wherein said high frequency signal line is a microstrip line.

6. A microstrip antenna as claimed in one of claims 1 to 4, wherein said high frequency signal line is a tri-plate line.

7. A microstrip antenna as claimed in one of claims 1 to 4, wherein a plurality of said radiation elements are provided.

8. A microstrip antenna as claimed in one of claims 1 to 4, wherein said antenna is provided with electronic circuit means for processing signals received by and transmitted from said radiation element, disposed in contact with a dielectric film member in a lamination.

9. A microstrip antenna as claimed in one of claims 1 to 4, wherein said antenna is provided with electronic circuit means for processing antenna signals, in operative contact with said ground film member.

10. A microstrip antenna as claimed in one of claims 1 to 4, wherein a cavity space is formed by removing at least one dielectric film member.

11. A microstrip antenna as claimed in one of claims 1 to 4, wherein circuit element means are provided at an interface between said dielectric film members.

12. A microstrip antenna as claimed in claim 11, wherein said circuit element means are capacitors.

13. A microstrip antenna as claimed in claim 11, wherein said circuit element means are resistors.

14. A microstrip antenna as claimed in one of claims 1 to 4, wherein said dielectric film members comprise alumina ceramic material.

15. A microstrip antenna as claimed in one of claims 1 to 4, wherein said dielectric film members comprise polyamide film.