Light modulator

• US 6,384,955 B2
• Filed: 04/23/2001
• Issued: 05/07/2002
• Est. Priority Date: 08/07/1998
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Tada, Hitoshi, Kadowaki, Tomoko
• Primary Examiner(s): Epps, Georgia
• Assistant Examiner(s): Thompson, Timothy J
• Application Number:
  US09/839,120
• Publication Number:
  US 20010022681A1
• Time in Patent Office: 379 Days
• Field of Search: 385/14, 385/129, 385/132, 359/248, 438/39, 438/31
• US Class Current: 359/248
• CPC Class Codes: G02F 1/025 in an optical waveguide structure G02F1/017, G02F1/2257 take precedence
• CPC Class Codes: G02F 2201/066 channel; buried
• CPC Class Codes: G02F 2201/122 having a particular pattern

Abstract

A light modulator includes a semiconductor substrate having a main surface, a rear surface, and a grounding conductor on the rear surface. A wave guide section having a width is located on the semiconductor substrate. A bonding pad section on the semiconductor substrate is located adjacent to the wave guide section and an insulating layer covers the main surface of the semiconductor substrate. A portion of the insulating layer immediately opposite the bonding pad section includes a multiple layer structure of insulating films. An electrode opposite the bonding pad section is electrically connected to the wave guide section.

Claims

1. A light modulator comprising;

a semiconductor substrate having a main surface, a rear surface, and a grounding conductor on the rear surface;

a wave guide section having a width and located on said semiconductor substrate;

a bonding pad section on said semiconductor substrate at a location adjacent said wave guide section;

an insulating layer covering the main surface of said semiconductor substrate, a portion of said insulating layer immediately opposite said bonding pad section comprising a multiple layer structure including insulating films; and

an electrode opposite said bonding pad section and electrically connected to said wave guide section.

2. The light modulator according to claim 1, wherein said insulating films include an insulating film of silicon oxide and an insulating film of silicon nitride.

3. The light modulator according to claim 1, wherein one of said insulating films is selected from the group consisting of an insulating film of silicon oxide and an insulating film of silicon nitride.

4. The light modulator according to claim 1, wherein said wave guide section includes a light absorption layer and a stripe portion on said light absorption layer, said stripe portion having the width.

5. A light modulator comprising:

a semiconductor substrate having a main surface, a rear surface, and a grounding conductor on the rear surface;

a wave guide section having a width and located on said semiconductor substrate;

a bonding pad section on said semiconductor substrate at a location adjacent said wave guide section;

an insulating layer covering the main surface of said semiconductor substrate, said insulating layer having first and second portions,

said first portion of said insulating layer being immediately opposite said bonding pad section, and comprising a multiple layer structure including a plurality of insulating films, and having a first thickness, and

said second portion of said insulating layer having a second thickness smaller than the first thickness; and

an electrode opposite said bonding pad section and electrically connected to said wave guide section.

6. The light modulator according to claim 5, wherein one of said insulating films is selected from the group consisting of an insulating film of silicon oxide and an insulating film of silicon nitride.

7. The light modulator according to claim 5, wherein said insulating films include an insulating film of silicon oxide and an insulating film of silicon nitride.

8. The light modulator according to claim 5, wherein said wave guide section includes a light absorption layer and a stripe portion on said light absorption layer, said stripe portion having the width.

9. A light modulator comprising:

a semiconductor substrate having a main surface, a rear surface, and a grounding conductor on the rear surface;

a wave guide section having a width and located on said semiconductor substrate,

a bonding pad section on said semiconductor substrate at a location adjacent said wave guide section;

an insulating layer covering the main surface of said semiconductor substrate, said insulating layer having first and second portions, said first portion of said insulating layer being immediately opposite said bonding pad section and having a first thickness, said second portion of said insulating layer having a second thickness, smaller than the first thickness, said first and second portions consisting of the same material; and

an electrode opposite said bonding section and electrically connected to said wave guide section.

10. The light modulator according to claim 9, wherein said first and second portions of said insulating layer are selected from the group consisting of silicon oxide and silicon nitride.

11. The light modulator according to claim 9, wherein said wave guide section includes a light absorption layer and a stripe portion on said light absorption layer, said stripe portion having the width.