PCB vertical and horizontal guide

• US 6,385,053 B1
• Filed: 02/26/1999
• Issued: 05/07/2002
• Est. Priority Date: 02/26/1999
• Status: Expired due to Term

• Current Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Original Assignee: Cisco Technology, Inc. (Cisco Systems, Inc.)
• Inventors: Chern, Michael, Nguyen, Nguyen, Parizi, Bobby, Seyedarab, Saeed H.
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): Tran, Thanh Y.
• Application Number:
  US09/258,446
• Time in Patent Office: 1,166 Days
• Field of Search: 361/788, 361/786, 361/802, 361/756, 361/741, 361/727, 361/686, 361/724, 361/726, 361/747, 361/752, 361/803, 439/631-633, 439/157, 439/65, 439/64, 439/374, 439/377, 439/378-379, 439/638-640, 439/201, 439/79, 317/101.DH, 339/17.L
• US Class Current: 361/786
• CPC Class Codes: H01R 12/7005 Guiding, mounting, polarizing or locking means; Extractors for printed circuit boards H05K
• CPC Class Codes: H05K 7/1418 Card guides, e.g. grooves H05K7/1425 takes precedence
• CPC Class Codes: H05K 7/1454 Alignment mechanisms; Drawout cases

Abstract

A guide device receives and engages a cutout in a distal pin-bearing edge of a printed circuit board for aligning pins with pin sockets. The alignment device includes a web, sized and shaped to be received in a circuit board cutout and a shelf surface for engaging a part of a major surface of the circuit board, to provide for biaxial guidance during board insertion. By positioning guide devices and circuit board cutouts in different locations, for different circuit boards, insertion of circuit boards in an incorrect slot or location is avoided.

Claims

1. Apparatus for providing component alignment during circuit board installation comprising:

a chassis;

a circuit board having first and second major surfaces and at least a first edge, and second and third edges adjacent to said first edge, with a first cutout region formed in said first edge and a plurality of pins extending outward from said first edge, said cutout region defining at least a first cutout leading edge;

a pin block having a plurality of pin-receiving sockets positioned to receive said plurality of pins when said circuit board is located in a first aligned position, wherein, when said circuit board is in said first aligned position, said first and second major surfaces are substantially horizontal;

a guidance device including a first web defining a web leading edge spaced a first distance from said pin block, at least a portion of said first web sized and shaped to be received within said circuit board cutout region, said first web defining a web plane;

wherein said guidance device is positioned such that said first web is located within said first cutout region of said circuit board when said circuit board is in said first aligned location wherein at least a first surface of said web adjacent said web leading edge is chamfered to provide a width of said leading edge of said web which is less than the maximum width of said web, wherein bearing of at least said first leading edge of said cutout region against said chamfered surface of said web when said circuit board is moved substantially horizontally towards said first aligned position imparts a force at a location spaced from said second and third edges, tending to align said circuit board such that said plurality of pins are aligned with said pin-receiving sockets.

2. Apparatus as claimed in claim 1, wherein said guidance device includes a shelf surface for engaging a portion of a major surface of said circuit board.

3. Apparatus as claimed in claim 2, wherein said shelf surface includes at least a first planar region substantially perpendicular to said web plane.

4. Apparatus as claimed in claim 2, wherein said shelf surface includes a region adjacent to said leading edge which is chamfered.

5. Apparatus as claimed in claim 4, where said cutout region is positioned a first distance from the closest of a first side-edge of said circuit board and a second side-edge of said circuit board.

6. Apparatus as claimed in claim 1, further comprising:

a second circuit board, different from said first circuit board, having a cutout region on a pin-bearing edge of said second circuit board said cutout region of second circuit board positioned a second distance from the closest of a first and a second side-edge of said second circuit board, said second distance being different from said first distance;

a second guidance device positioned to engage said cutout region of said second circuit board when said second circuit board is positioned with pins of said pin-bearing edges aligned with pin sockets on said chassis; and

wherein said first guidance device is positioned to prevent full insertion of pins of said second circuit board in pin sockets adjacent said first aligned location.

7. Apparatus for providing component alignment during circuit board installation comprising:

a chassis;

a circuit board having first and second major surfaces and at least a first edge, and second and third edges adjacent to said first edge, with a first guide receiving means formed in said first edge and a plurality of pins extending outward from said first edge, said guide receiving means defining a guide receiving means leading edge;

pin-receiving means positioned to receive said plurality of pins when said circuit board is located in a first aligned position, wherein, when said circuit board is in said first aligned position, and first and second major surfaces are substantially horizontal;

means for guiding, including a horizontal guide means, defining a first leading edge spaced a first distance from said pin receiving means, at least a portion of said horizontal guide means sized and shaped to be received within said guide receiving means, said horizontal guide means defining a first plane;

wherein said means for guiding is positioned such that said horizontal guide means is located within said first guide receiving means of said circuit board when said circuit board is in said first aligned location wherein at least a first surface of said horizontal guide means adjacent said first leading edge is chamfered to provide a width of said first leading edge of said horizontal guide means which is less than the maximum width of said horizontal guide means, wherein bearing of said guide receiving means leading edge against said chamfered first surface of said horizontal guide means when said circuit board is moved substantially horizontally towards said first aligned position imparts a force at a location spaced from said second and third edges, tending to align said circuit board such that said plurality of pins are aligned with said pin-receiving means.

8. Apparatus as claimed in claim 7, wherein said guidance device includes vertical guide means for engaging a portion of a major surface of said circuit board.

9. Apparatus as claimed in claim 8, wherein said vertical guide means includes at least a first planar region substantially perpendicular to said first plane.

10. Apparatus as claimed in claim 9, wherein said vertical guide means includes a region adjacent to said first leading edge which is chamfered.

11. Apparatus as claimed in claim 7, wherein said guide receiving means is positioned a first distance from the closest of a first side-edge of said circuit board and a second side-edge of said circuit board.

12. Apparatus as claimed in claim 11, further comprising:

a second circuit board, different from said first circuit board, having a guide receiving means on a pin-bearing edge of said second circuit board said guide receiving means of second circuit board positioned a second distance from the closest of a first and a second side-edge of said second circuit board, said second distance being different from said first distance;

a second guide means positioned to engage said guide receiving means of said second circuit board when said second circuit board is positioned with pins of said pin-bearing edges aligned with pin receiving means on said chassis; and

wherein said first guide means is positioned to prevent full insertion of pins of said second circuit board in pin receiving means adjacent said first aligned location.

13. A method for aligning components during circuit board installation in a chassis comprising:

providing a circuit board having first and second major surfaces and at least a first edge, and second and third edges adjacent to said first edge, with a first cutout region formed in said first edge and a plurality of pins extending outward from said first edge said cutout region defining at least a first cutout leading edge;

providing a pin block having a plurality of pin-receiving sockets positioned on said chassis to receive said plurality of pins when said circuit board is located in a first aligned position, wherein, when said circuit board is in first aligned position, said first and second major surfaces are substantially horizontal;

positioning a guidance device on said chassis, said guidance device including a first web defining a web leading edge spaced a first distance from said pin block, at least a portion of said first web sized and shaped to be received within said circuit board cutout region, said first web defining a web plane;

wherein said step of positioning said guidance device includes positioning said guidance device such that said first web is located within said first cutout region of said circuit board when said circuit board is in said first aligned location wherein at least a first surface of said web adjacent said web leading edge is chamfered to provide a width of said leading edge of said web which is less than the maximum width of said web wherein bearing of at least said first leading edge of said cutout region against said chamfered surface of said web when said circuit board is moved substantially horizontally towards said first aligned position imparts a force at a location spaced from said second and third edges, tending to align said circuit board such that said plurality of pins are aligned with said pin-receiving sockets; and

inserting said circuit board to engage said web.

14. A method as claimed in claim 13, wherein said step of inserting comprises engaging said web with at least a said first chamfered surface of said web.

15. A method as claimed in claim 13, wherein said guidance device includes a shelf surface and wherein said step of inserting comprises engaging a portion of a major surface of said circuit board with said shelf.

16. A method as claimed in claim 15, wherein said shelf surface includes at least a first planar region substantially perpendicular to said web plane.

17. A method as claimed in claim 15, wherein said step of inserting comprises engaging said portion of a major surface of said circuit board with at least a first chamfered surface of said shelf.

18. A method as claimed in claim 13, where said cutout region is positioned a first distance from the closest of a first and a second side-edge of said circuit board.

19. A method as claimed in claim 18, further comprising:

providing a second circuit board, different from said first circuit board, having a cutout region on a pin-bearing edge of said second circuit board said cutout region of second circuit board positioned a second distance from the closest of a first and a second side-edge of said second circuit board, said second distance being different from said first distance;

positioning a second guidance device in said chassis to engage said cutout region of said second circuit board when said second circuit board is positioned with pins of said pin-bearing edges aligned with pin sockets on said chassis; and

wherein said first guidance device is positioned to prevent full insertion of pins of said second circuit board in pin sockets adjacent said first aligned location.