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Cooler

  • US 6,386,278 B1
  • Filed: 07/27/1999
  • Issued: 05/14/2002
  • Est. Priority Date: 08/04/1998
  • Status: Expired due to Fees
First Claim
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1. A cooler for using as a heat sink for electrical or electronic components such as component elements, electronic circuits, modules, where the cooler forms at least one cooling surface for the electrical or electronic components and comprises a plurality of cooler layers arranged in a stack and connected to each other on a surface, said layers being structured by providing with a number of openings or passages to form a cooler structure with at least a two dimensional branching flow routes for a coolant in at least two spatial axes (X-axis;

  • Y-axis, Z-axis) in an interior of the cooler between at least one intake and at least one outlet for the coolant, at least part of the plurality of cooler layers forming the cooler structure being structured in such a way, that ratio of the surface area occupied by the openings or passages to the surface area not occupied by the openings or passages decreases in a direction from the intake to the outlet such, that within the cooler structure a flow resistance between areas of cooler structure located closer to said at least one cooling surface and areas of cooler structure located further away from said at least one cooling surface increases respectively from the at least one intake toward the at least one outlet.

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