Microelectromechanical valves including single crystalline material components

• US 6,386,507 B2
• Filed: 03/08/2001
• Issued: 05/14/2002
• Est. Priority Date: 09/01/1999
• Status: Expired due to Term

• Current Assignee: Lumentum Operations, LLC (Lumentum Holdings Inc.)
• Original Assignee: JDS Uniphase Corporation (Lumentum Holdings Inc.)
• Inventors: Walters, Mark David, Dhuler, Vijayakumar R.
• Primary Examiner(s): Derakshani, Philippe
• Assistant Examiner(s): BONDERER, DAVID A
• Application Number:
  US09/802,260
• Publication Number:
  US 20010017358A1
• Time in Patent Office: 432 Days
• Field of Search: 251/11, 251/129.02, 251/129.01, 251/129.03, 310/307
• US Class Current: 251/11
• CPC Class Codes: B81B 2201/031 Thermal actuators
• CPC Class Codes: B81B 2201/054 Microvalves
• CPC Class Codes: B81B 2203/0109 Bridges
• CPC Class Codes: B81B 2203/051 Translation according to an axis parallel to the substrate
• CPC Class Codes: B81B 3/0051 For defining the movement, i.e. structures that guide or limit the movement of an element mechanical arrangements for preventing or damping vibration or shock H01H3/60
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: F15C 5/00 Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
• CPC Class Codes: F16K 2099/0074 using photolithography, e.g. etching
• CPC Class Codes: F16K 2099/008 Multi-layer fabrications
• CPC Class Codes: F16K 99/0001 Microvalves microdevices B81B1/00; manufacture or treatment of devices or systems in or on a substrate B81C1/00; microfluidic structures B01L3/5027; micropumps F04B19/006
• CPC Class Codes: F16K 99/0007 of cantilever type
• CPC Class Codes: F16K 99/0009 the valve element held by multiple arms
• CPC Class Codes: F16K 99/0011 Gate valves or sliding valves
• CPC Class Codes: F16K 99/0036 operated by temperature variations
• CPC Class Codes: H01H 2001/0042 Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet

Abstract

A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening.

Claims

1. A microelectromechanical valve comprising:

a microelectronic substrate defining at least one opening therethrough;

a thermally actuated microactuator disposed upon the substrate and comprised of a single crystalline material; and

at least one valve plate comprised of the single crystalline material, the at least one valve plate being operably engaged with the microactuator and adapted to move upon thermal actuation of the microactuator.

2. A microelectromechanical valve according to claim 1, wherein the at least one valve plate further comprises at least one valve seat, the at least one valve plate adapted to move the at least one valve seat between a disengaged open position and an engaged closed position with respect to the at least one opening upon thermal actuation of the microactuator.

3. A microelectromechanical valve according to claim 2 wherein the microactuator further comprises:

spaced apart supports disposed on the substrate; and

at least one arched beam extending between the spaced apart supports and operably engaged with the at least one valve plate.

4. A microelectromechanical valve according to claim 3 wherein the microactuator further comprises means for heating the at least one arched beam to cause further arching thereof such that the valve seat moves between a first position in which the valve seat is engaged with the at least one opening and closes the valve and a second position in which the valve seat is disengaged from the at least one opening and opens the valve.

5. A microelectromechanical valve according to claim 3 wherein the microactuator further comprises an actuator member for coupling the plurality of arched beams together.

6. A microelectromechanical valve according to claim 2 wherein the valve plate is disposed in a normally closed position with respect to the opening such that thermal actuation of the microactuator displaces the valve plate and causes the valve seat to disengage and open the opening.

7. A microelectromechanical valve according to claim 2 wherein the valve plate is disposed in a normally open position with respect to the opening such that thermal actuation of the microactuator displaces the valve plate and causes the valve seat to engage and close the opening.

8. A microelectromechanical valve according to claim 2 wherein the at least one valve seat is comprised of at least one of a single crystalline silicon, silicon nitride, and polysilicon.

9. A microelectromechanical valve according to claim 1 wherein the microactuator is thermally actuated by internal heating thereof.

10. A microelectromechanical valve according to claim 1 wherein the microactuator is thermally actuated by external heating thereof.

11. A microelectromechanical valve according to claim 1 wherein the microactuator is comprised of single crystalline silicon.

12. A microelectromechanical valve according to claim 1 wherein the at least one valve plate is comprised of single crystalline silicon.

13. A microelectromechanical valve according to claim 1 further comprising at least one mechanical stop disposed adjacent the valve plate for providing an out-of-plane restraint for the valve plate with respect to the substrate.

14. A microelectromechanical valve comprising:

a microelectronic substrate defining at least one opening therethrough;

a thermally actuated microactuator disposed upon the substrate and comprised of a single crystalline material;

at least one valve plate comprised of a single crystalline material the at least one valve plate being operably engaged with the microactuator and adapted to move upon thermal actuation of the microactuator; and

at least one latch disposed on the substrate and capable of interacting with the valve plate following a predetermined displacement thereof due to thermal actuation of the microactuator such that the valve plate may be restrained in a predetermined position with respect to the opening.

15. A microelectromechanical valve according to claim 14 wherein the latch is at least one of a thermally actuated latch and an electrostatically actuated latch.