High temperature co-fired ceramic and low temperature co-fired ceramic combination electronic package device and method

• US 6,387,507 B1
• Filed: 03/31/2000
• Issued: 05/14/2002
• Est. Priority Date: 03/31/2000
• Status: Expired due to Fees

• Current Assignee: Polese Company Incorporated
• Original Assignee: Polese Company Incorporated
• Inventors: Kunesh, Robert B., Jones, Kenneth L. II
• Primary Examiner(s): Dawson, Robert
• Assistant Examiner(s): Feely, Michael J
• Application Number:
  US09/540,194
• Time in Patent Office: 774 Days
• Field of Search: 428/413, 428/414, 428/415, 428/416, 428/417, 428/418, 428/901
• US Class Current: 428/416
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
• CPC Class Codes: H05K 3/4688 Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602
• CPC Class Codes: Y10T 428/31515 As intermediate layer
• CPC Class Codes: Y10T 428/31522 Next to metal

Abstract

A microelectronic multilayer ceramic package combines a high temperature cofired ceramic (HTCC) module or carrier with a low temperature cofired ceramic (LTCC) module or carrier using a bonding interface layer of electrically nonconductive epoxy having electrically conductive regions for providing electrical interconnection between carriers. The bonding layer also has regions of thermally conductive material for interfacing heat sources on one carrier with heat dissipators on another carrier. The bonding layer also has apertures which allow prominent structures extending from one carrier to pass though and into a corresponding cavity in another carrier.

Claims

1. A microelectronic ceramic package comprises:

a first high temperature co-fired ceramic body;

a second low temperature co-fired ceramic body;

a bonding layer mating said first body to said second body;

wherein said bonding layer comprises;

an electrically non-conductive portion, and a plurality of electrically conductive portions.

2. The package of claim 1, wherein said electrically non-conductive portion comprises electrically non-conductive epoxy.

3. The package of claim 1, wherein said package further comprises:

each of said bodies bonded to one another along a substantially planar contact surface;

a component mounted upon one of said bodies extending beyond the plane of said contact surface and penetrating into a corresponding cavity in an other of said bodies; and

said bonding layer having an aperture sized and located to allow passage of said component therethrough.

4. The package of claim 1, wherein said package further comprises:

said first body having a first electrical contact pad located thereon and said second body having a second electrical contact pad located thereon; and

wherein said electrically conductive portions comprise;

a plurality of electrically conductive slugs embedded into said bonding layer;

each of said slugs being located to interconnect said first pad and said second pad.

5. The package of claim 1, wherein said bonding layer further comprises an aperture formed through said layer for allowing passage of a microelectronic component therethrough.

6. The package of claim 5, wherein said microelectronic component is encapsulated by said first and second body and said bonding layer.