Time-based semiconductor material attachment

• US 6,387,733 B1
• Filed: 05/22/2001
• Issued: 05/14/2002
• Est. Priority Date: 05/22/2001
• Status: Expired due to Fees

• Current Assignee: RF Micro Devices Incorporated (Qorvo, Inc.)
• Original Assignee: RF Micro Devices Incorporated (Qorvo, Inc.)
• Inventors: Bailey, John Cody, Holyoak, Howard Joseph
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Stevenson, Andre C
• Application Number:
  US09/862,872
• Time in Patent Office: 357 Days
• Field of Search: 438/14, 438/107, 438/118, 438/106, 438/123, 257/684, 228/4.5, 324/755, 118/406
• US Class Current: 438/123
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83194 Lateral distribution of the layer connectors
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/0665 Epoxy resin
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor

Abstract

The present invention controls attachment of a first semiconductor material, such as a semiconductor die, to a second semiconductor material, such as a bond pad, substrate, or the like. A placement tool is used to pick up the first semiconductor material and move it to a defined position above the top surface of the second semiconductor material. The second semiconductor material will have an adhesive, such as epoxy, applied to its top surface. From the defined position above the second semiconductor material, the placement tool is allowed to fall for an amount of time previously determined to result in an adhesive layer of a defined thickness, within precise tolerances. The adhesive thickness is often referred to as bond line thickness (BLT) when bonding a semiconductor die to a bond pad, substrate, or the like.

Claims

1. A method for attaching semiconductor materials during manufacture comprising:

a) moving a placement tool carrying a first semiconductor material to a first position over a second semiconductor material having an adhesive placed thereon;

b) releasing the placement tool to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the placement tool to fall toward and into the adhesive sufficiently to leave a defined thickness of the adhesive between the first and second semiconductor materials; and

c) stopping the fall of the placement tool after the predefined period of time.

2. The method of claim 1 wherein the first semiconductor material is a semiconductor die.

3. The method of claim 2 wherein the second semiconductor material is a bond pad and the defined thickness of the adhesive is a desired bond line thickness for the adhesive between the semiconductor die and the bond pad.

4. The method of claim 1 wherein the stopping step comprises moving the placement tool away from the second semiconductor material.

5. The method of claim 1 further comprising determining the predefined period of time by identifying a time necessary to allow the placement tool to descend from the first position to the adhesive and into the adhesive to leave the defined thickness of the adhesive between the first and second semiconductor materials.

6. The method of claim 1 further comprising controlling a vertical position of the placement tool using a vacuum and wherein the releasing step comprises releasing the vacuum to allow the placement tool to fall as the vacuum decays.

7. The method of claim 1 further comprising initially picking up the first semiconductor material with the placement tool.

8. The method of claim 1 further comprising placing the adhesive on the second semiconductor material in a predefined fashion.

9. A method for attaching semiconductor die during manufacture comprising:

a) moving a placement tool carrying a semiconductor die to a first position over a second semiconductor material having an adhesive placed thereon;

b) releasing the placement tool to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the placement tool to fall toward and into the adhesive sufficiently to leave a predefined bond line thickness for the adhesive between the semiconductor die and the second semiconductor material; and

c) stopping the fall of the placement tool after the predefined period of time.

10. The method of claim 9 wherein the second semiconductor material is a bond pad mounted on a substrate.

11. The method of claim 9 further comprising determining the predefined period of time by identifying a time necessary to allow the placement tool to descend from the first position to the adhesive and into the adhesive to leave the predefined bond line thickness for the adhesive between the first and second semiconductor materials.

12. A system for controlling attachment of semiconductor materials during manufacture of a semiconductor comprising a control system with a placement tool adapted to pick up and move a first semiconductor material, said control system adapted to:

a) move the placement tool carrying the first semiconductor material to a first position over a second semiconductor material having an adhesive placed thereon;

b) release the placement tool to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the placement tool to fall toward and into the adhesive sufficiently to leave a defined thickness of the adhesive between the first and second semiconductor materials; and

c) stop the fall of the placement tool after the predefined period of time.

13. The system of claim 12 wherein the first semiconductor material is a semiconductor die.

14. The system of claim 13 wherein the second semiconductor material is a bond pad and the defined thickness of the adhesive is a desired bond line thickness for the adhesive between the semiconductor die and the bond pad.

15. The system of claim 12 wherein the control system is adapted to stop the fall of the placement tool by moving the placement tool away from the second semiconductor material after the predefined period of time elapses.

16. The system of claim 12 wherein the predefined period of time is determined by identifying a time necessary to allow the placement tool to descend from the first position to the adhesive and into the adhesive to leave the defined thickness of the adhesive between the first and second semiconductor materials.

17. The system of claim 12 further comprising a vacuum system adapted to control a vertical position of the placement tool using a vacuum and wherein the control system is adapted to release the placement tool by releasing the vacuum to allow the placement tool to fall as the vacuum in the vacuum system decays.

18. The system of claim 12 wherein the control system is further adapted to initially pick up the first material with the placement tool prior to moving the placement tool to the first position.

19. A system for attaching semiconductor materials during manufacture comprising:

a) means for placement of a first semiconductor material;

b) means for moving the means for placement carrying the first semiconductor material to a first position over a second semiconductor material having an adhesive placed thereon;

c) means for releasing the means for placement to fall toward the second semiconductor material for a predefined period of time, which is predetermined to allow the means for placement to fall toward and into the adhesive sufficiently to leave a defined thickness of the adhesive between the first and second semiconductor materials; and

d) means for stopping the fall of the means for placement after the predefined period of time.

20. The system of claim 19 wherein the first semiconductor material is a semiconductor die.

21. The method of claim 20 wherein the second semiconductor material is a bond pad and the defined thickness of the adhesive is a desired bond line thickness for the adhesive between the semiconductor die and bond pad.