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Semiconductor package, semiconductor device, electronic device and production method for semiconductor package

  • US 6,387,734 B1
  • Filed: 05/24/2001
  • Issued: 05/14/2002
  • Est. Priority Date: 06/11/1999
  • Status: Expired due to Term
First Claim
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1. A semiconductor package, comprising:

  • an insulating layer formed on a wafer that is provided with an electrode;

    a rerouting layer penetrating through said insulating layer, the one end of said rerouting layer being connected to said electrode;

    a sealing resin layer which seals said wafer, said insulating layer and said rerouting layer;

    a columnar resin material which is defined by making a ring-like opening portion in a resin layer constituting said sealing resin layer and which is formed on said rerouting layer; and

    a conductive layer which is formed around said columnar resin material to cover said columnar resin material and which penetrates through said sealing resin layer to conduct electricity between a solder bump and the other end of said rerouting layer.

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