Semiconductor package, semiconductor device, electronic device and production method for semiconductor package
First Claim
Patent Images
1. A semiconductor package, comprising:
- an insulating layer formed on a wafer that is provided with an electrode;
a rerouting layer penetrating through said insulating layer, the one end of said rerouting layer being connected to said electrode;
a sealing resin layer which seals said wafer, said insulating layer and said rerouting layer;
a columnar resin material which is defined by making a ring-like opening portion in a resin layer constituting said sealing resin layer and which is formed on said rerouting layer; and
a conductive layer which is formed around said columnar resin material to cover said columnar resin material and which penetrates through said sealing resin layer to conduct electricity between a solder bump and the other end of said rerouting layer.
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Abstract
An insulating layer (3) is formed on a Si wafer (1). An opening portion is made in this insulating layer (3), and subsequently a rerouting layer (2) is formed. Next, a resin layer (4) is formed on the rerouting layer (2). The resin layer (4) is then cured so that the rerouting layer (2) and a Cu foil (5) are bonded to each other through the resin layer (4). Thereafter, a ring-like opening portion (4a) is made in the resin layer (4), and a Cu plating layer (8) is formed inside this opening portion (4a).
87 Citations
15 Claims
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1. A semiconductor package, comprising:
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an insulating layer formed on a wafer that is provided with an electrode;
a rerouting layer penetrating through said insulating layer, the one end of said rerouting layer being connected to said electrode;
a sealing resin layer which seals said wafer, said insulating layer and said rerouting layer;
a columnar resin material which is defined by making a ring-like opening portion in a resin layer constituting said sealing resin layer and which is formed on said rerouting layer; and
a conductive layer which is formed around said columnar resin material to cover said columnar resin material and which penetrates through said sealing resin layer to conduct electricity between a solder bump and the other end of said rerouting layer. - View Dependent Claims (2, 3, 6, 7, 11, 12, 13)
an integrated circuit formed in said wafer. -
7. An electronic device provided with said semiconductor device according to claim 6, comprising
a circuit board connected to said solder bump. -
11. The semiconductor package according to claim 2, further comprising a metal layer formed on said rerouting layer and at least at a position conformable to said ring-like opening portion, said metal layer having a higher reflectivity against a laser used when said ring-like opening portion is formed than said rerouting layer.
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12. A semiconductor device provided with said semiconductor package according to claim 2, comprising
an integrated circuit formed in said wafer. -
13. A semiconductor device provided with said semiconductor package according to claim 3, comprising
an integrated circuit formed in said wafer.
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4. A semiconductor package, comprising:
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a wafer that is provided with an electrode; and
a post formed on said wafer, wherein said post comprises a resin material and a conductive layer formed at least on an upper surface of said resin material, a spherical solder bump is formed on said conductive layer positioned on an upper surface of said post, and the central position of said solder bump is consistent with the central position of said post as are viewed in plan. - View Dependent Claims (5, 14, 15)
an integrated circuit formed in said wafer. -
15. A semiconductor device provided with said semiconductor package according to claim 5, comprising
an integrated circuit formed in said wafer.
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8. A method for producing a semiconductor package, comprising the steps of:
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forming an insulating layer on a wafer that is provided with an electrode;
forming a rerouting layer penetrating through said insulating layer, the one end of said rerouting layer being connected to said electrode;
forming a sealing resin layer on the entire surface;
making a ring-like opening portion reaching said rerouting layer in said sealing resin layer;
forming a conductive layer from inside of said opening portion to upper side of said sealing resin layer, thereby making a shape that said sealing resin layer remaining inside said opening portion is covered with said conductive layer; and
forming a solder bump on said conductive layer. - View Dependent Claims (9, 10)
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Specification