Antenna-integrated microwave-millimeter wave module

• US 6,388,623 B1
• Filed: 04/17/2001
• Issued: 05/14/2002
• Est. Priority Date: 04/18/2000
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Kitaoka, Koki, Sakota, Naoki, Yamada, Atsushi
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): Dinh, Trinh Vo
• Application Number:
  US09/835,356
• Publication Number:
  US 20020070901A1
• Time in Patent Office: 392 Days
• Field of Search: H01/Q.138, 343/700.MS, 343/767, 343/746, 343/770, 343/776, 343/785, 343/911.R, 343/853, 257/672, 257/676, 257/677, 257/508, 333/247
• US Class Current: 343/700.0MS
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01Q 1/3233 particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
• CPC Class Codes: H01Q 13/106 Microstrip slot antennas patch antenna elements H01Q9/0407
• CPC Class Codes: H01Q 21/064 using horn or slot aerials slotted waveguides arrays H01Q21/005
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.

Claims

1. An antenna-integrated microwave-millimeter wave module comprising:

a dielectric substrate;

a first conductor layer provided on said dielectric substrate and having a plurality of first holes formed therein to radiate electromagnetic waves;

a first dielectric layer provided on said first conductor layer;

an antenna feeding line provided on said first dielectric layer;

a second dielectric layer provided on said antenna feeding line;

a second conductor layer provided on said second dielectric layer and having a second hole formed therein;

a third dielectric layer provided on said second conductor layer;

a high-frequency circuit line provided on said third dielectric layer; and

a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed,

said first, second and third dielectric layers each having a thickness of λ

/4 or less, λ

representing wavelength of electromagnetic waves propagating through the dielectric layers, and

said first, second and third dielectric layers having a relative dielectric constant of 10 or less.

2. The antenna-integrated microwave-millimeter wave module according to claim 1, wherein

said dielectric substrate and said first conductor layer are laminated by lamination resin, and the total thickness of said dielectric substrate and said lamination resin is 0.1 to 0.3 times as large as said λ .

3. The antenna-integrated microwave-millimeter wave module according to claim 2, wherein

said lamination resin contains silicon or fluorine.

4. The antenna-integrated microwave-millimeter wave module according to claim 1, wherein

said dielectric substrate has a relative dielectric constant of 2 or more and 4 or less.

5. An antenna-integrated microwave-millimeter wave module comprising:

a first conductor layer having a plurality of first holes formed therein to radiate electromagnetic waves;

a first dielectric layer provided on said first conductor layer;

an antenna feeding line provided on said first dielectric layer;

a second dielectric layer provided on said antenna feeding line;

a second conductor layer provided on said second dielectric layer and having a second hole formed therein;

a third dielectric layer provided on said second conductor layer;

a high-frequency circuit line provided on said third dielectric layer and electromagnetically coupled with said antenna feeding line via said second hole; and

a semiconductor chip connected to said high-frequency circuit line and having a microwave or millimeter wave circuit formed,

said first holes including a feed slot hole fed by said antenna feeding line and a non-feed slot hole not fed by said antenna feeding line, and

distance d between said feed slot hole and said non-feed slot hole being approximately (0.5+n) λ

, λ

representing wavelength of electromagnetic waves propagating through the dielectric layers and n being an integer of at least 1.

6. The antenna-integrated microwave-millimeter wave module according to claim 5, wherein

said n is 1.

7. The antenna-integrated microwave-millimeter wave module according to claim 5, further comprising a dielectric substrate placed opposite said first conductor layer.

8. The antenna-integrated microwave-millimeter wave module according to claim 7, wherein

said dielectric substrate has a relative dielectric constant of 2 or more and 4 or less.

9. The antenna-integrated microwave-millimeter wave module according to claim 5, wherein

said first, second and third dielectric layers each have a thickness of λ

/4 or less, and

said first, second and third dielectric layers have a relative dielectric constant of 10 or less.

10. The antenna-integrated microwave-millimeter wave module according to claim 5, wherein

said dielectric substrate and said first conductor layer are laminated by said lamination resin and the total thickness of said dielectric substrate and said lamination resin is 0.1 to 0.3 times as larger as said λ

.

11. The antenna-integrated micro-millimeter wave module according to claim 10, wherein

said lamination resin contains silicon or fluorine.