Integrated thermal architecture for thermal management of high power electronics

• US 6,388,882 B1
• Filed: 07/19/2001
• Issued: 05/14/2002
• Est. Priority Date: 07/19/2001
• Status: Expired due to Term

• Current Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Original Assignee: Thermal Corporation (Roper Technologies, Inc.)
• Inventors: Phillips, A. L., Hoover, L. Ronald, Zuo, Jon
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Chervinsky, Boris Leo
• Application Number:
  US09/909,360
• Time in Patent Office: 299 Days
• Field of Search: 361/688-704, 361/715, 361/716, 361/718-721, 257/712, 257/714, 257/715, 174/15.1, 174/15.2, 174/16.1, 165/80-- 8, 165/104.33, 165/185, 457/184
• US Class Current: 361/704
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: H05K 7/20536 for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment

Abstract

The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electronic components and subsystems, in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.

Claims

1. A thermal energy management architecture for a functioning system of electronic components and subsystems comprising:

a first level of heat transfer devices comprising means for thermal energy spreading that are thermally driven and operatively engaged with at least one semiconductor chip;

a second level of heat transfer devices comprising means for thermal energy spreading that are thermally driven and operatively engaged with at least one semiconductor chip package;

a third level of heat transfer devices comprising means for thermal energy transport that are thermally driven and operatively engaged with at least one of said first level or second level means thermal energy spreading; and

a fourth level of heat transfer devices comprising means for thermal energy transport that are thermally driven and operatively engaged with at least one of said first level means, second means, or third level means.

2. The thermal energy management architecture according to claim 1 further comprising a fifth level of heat transfer device comprising one or more means for thermal energy transport that are thermally driven and operatively engaged with one or more individual high power components within said functioning system of electronic components and subsystems and arranged so as to by-pass said level three means.

3. The thermal energy management architecture according to claim 1 further comprising sixth level of non-passive heat transfer devices comprising means for thermal energy transport that are operatively engaged with at least one of said first level means, said second means, said third level means or said fourth level means.

4. The thermal energy management architecture according to claim 1 wherein said first level means for thermal energy spreading spreads thermal energy generated by at least one hot spot located on a semiconductor device positioned adjacent to said first level means across a substantial portion of a semiconductor package housing said semiconductor device so that the thermal energy may be removed.

5. The thermal energy management architecture according to claim 1 wherein said first level means for thermal energy spreading comprises a miniature heat pipe heat spreader.

6. The thermal energy management architecture according to claim 1 wherein said first level means for thermal energy spreading comprises a miniature heat pipe heat spreader having a sintered powder wicks to enhance boiling of a conventional working coolant fluid.

7. The thermal energy management architecture according to claim 1 wherein said first level means for thermal energy spreading comprises a miniature pulsating heat pipe located in thermal flow communication with a semiconductor device.

8. The thermal energy management architecture according to claim 1 wherein said second level means for thermal energy spreading comprise at least one of solid copper and aluminum heat spreaders.

9. The thermal energy management architecture according to claim 8 wherein said at least one of solid copper and aluminum heat spreaders include embedded heat pipes.

10. The thermal energy management architecture according to claim 1 wherein said second level means for thermal energy spreading comprise a vapor chamber heat spreader having a sintered wick positioned within a sealed chamber.

11. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a loop thermosiphon.

12. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a loop heat pipe.

13. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a combination of a loop heat pipe and a loop thermosiphon.

14. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a plurality of loop heat pipes and a loop thermosiphons.

15. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a loop thermosiphon forming a portion of a rack/chassis that supports said functioning system of electronic components and subsystems.

16. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a loop heat pipe forming a portion of a rack/chassis that supports said functioning system of electronic components and subsystems.

17. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a combination of a loop heat pipe and a loop thermosiphon that form a portion of a rack/chassis that supports said functioning system of electronic components and subsystems.

18. The thermal energy management architecture according to claim 1 wherein said third level means for thermal energy transport comprise a plurality of loop heat pipes and a loop thermosiphons that form a portion of a rack/chassis that supports said functioning system of electronic components and subsystems.

19. The thermal energy management architecture according to claim 1 wherein said fourth level means for thermal energy transport comprise a loop thermosiphon.

20. The thermal energy management architecture according to claim 1 wherein said fourth level means for thermal energy transport comprise a loop heat pipe.

21. The thermal energy management architecture according to claim 1 wherein said fourth level means for thermal energy transport comprise a combination of a loop heat pipe and a loop thermosiphon.

22. The thermal energy management architecture according to claim 1 wherein said fourth level means for thermal energy transport comprise a plurality of loop heat pipes and a loop thermosiphons.

23. A thermal energy management architecture for a functioning system of electronic components and subsystems comprising:

a first level of heat transfer devices comprising means for thermal energy spreading that include self-contained means for driving a thermal energy spreading mechanism and are operatively engaged with at least one semiconductor chip;

a second level of heat transfer devices comprising means for thermal energy spreading that include self-contained means for driving a thermal energy spreading mechanism and are operatively engaged with at least one semiconductor chip package;

a third level of heat transfer devices comprising means for busing thermal energy that include self-contained means for driving a thermal energy busing mechanism, and are operatively engaged with at least one of said first level and said second level means for thermal energy spreading; and

a fourth level of heat transfer devices comprising means for busing thermal energy that include self-contained means for driving a thermal energy busing mechanism, and are operatively engaged with at least one of said first level means, said second level means, and said third level means.

24. The thermal energy management architecture according to claim 23 further comprising a fifth level of heat transfer device comprising one or more means for thermal energy transport that are thermally driven and operatively engaged with one or more individual high power components within said functioning system of electronic components and subsystems and arranged so as to by-pass said level three means.

25. A thermal energy management architecture for a functioning system of electronic components and subsystems comprising:

a first level of heat transfer devices comprising means for thermal energy spreading that are substantially thermally driven and operatively engaged with at least one semiconductor chip;

a second level of heat transfer devices comprising means for thermal energy spreading that are substantially thermally driven and operatively engaged with at least one semiconductor chip package;

a third level of heat transfer devices comprising means for busing thermal energy that are substantially thermally and operatively engaged with at least one of said first level and said second level means for thermal energy spreading; and

a fourth level of heat transfer devices comprising means for busing thermal energy that are substantially thermally driven and operatively engaged with at least one of said first level means, said second level means, and said third level means.

26. The thermal energy management architecture according to claim 25 further comprising a fifth level of heat transfer device comprising one or more means for thermal energy transport that are thermally driven and operatively engaged with one or more individual high power components within said functioning system of electronic components and subsystems and arranged so as to by-pass said level three means.

27. A thermal energy management architecture for a functioning system of electronic components and subsystems comprising:

a first level of heat transfer devices comprising means for thermal energy spreading that are substantially thermally driven or include self-contained means for driving a thermal energy spreading mechanism, and are operatively engaged with at least one semiconductor chip;

a second level of heat transfer devices comprising means for thermal energy spreading that are substantially thermally driven or include self-contained means for driving a thermal energy spreading mechanism, and are operatively engaged with at least one semiconductor chip package;

a third level of heat transfer devices comprising means for busing thermal energy that are substantially thermally driven or include self-contained means for driving a thermal energy busing mechanism, and are operatively engaged with at least one of said first level and said second level means for thermal energy spreading; and

a fourth level of heat transfer devices comprising means for busing thermal energy that are either substantially thermally driven or include self-contained means for driving a thermal energy busing mechanism, and are operatively engaged with at least one of said first level means, said second level means, and said third level means.

28. The thermal energy management architecture according to claim 27 further comprising a fifth level of heat transfer device comprising one or more means for thermal energy transport that are thermally driven and operatively engaged with one or more individual high power components within said functioning system of electronic components and subsystems and arranged so as to by-pass said level three means.