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Surface mount type package unit

  • US 6,388,887 B1
  • Filed: 11/28/2000
  • Issued: 05/14/2002
  • Est. Priority Date: 12/27/1993
  • Status: Expired due to Fees
First Claim
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1. A surface mount type package unit comprising:

  • a circuit board;

    a conductive member provided on the circuit board;

    a package body having a mounted surface and mounted on the circuit board with the mounted surface facing the circuit board through the conductive member;

    a circuit element held on the package body;

    a first conductor provided on the mounted surface of the package body adjacently to an end portion of the mounted surface and electrically connected to the circuit element, the first conductor directly connected to the conductive member of the circuit board through solder; and

    a second conductor provided on the mounted surface of the package body and connected to the conductive member of the circuit board through solder;

    wherein the solder connecting the first conductor and the conductive member is exposed to an outside of the mounted surface of the package body when the first conductor is joined to the conductive member through the solder; and

    wherein a clearance between the package body and the circuit board is held by the first conductor or the second conductor connected to the conductive member by the solder.

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