Method of fabricating image sensor packages in an array

• US 6,389,687 B1
• Filed: 12/08/1999
• Issued: 05/21/2002
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US09/457,517
• Time in Patent Office: 895 Days
• Field of Search: 298/25, 298/30, 298/32, 298/40, 298/46, 298/36, 297/40
• US Class Current: 29/832
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14625 : Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/53178 : Chip component

Abstract

Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

Claims

1. A method comprising:

forming a plurality of moldings simultaneously in a mold, said plurality of moldings being integrally connected together;

removing a molded window array comprising said plurality of moldings from said mold;

aligning said molded window array with a substrate; and

bringing said molded window array into abutting contact with said substrate.

2. The method of claim 1 wherein said forming a plurality of moldings simultaneously comprises placing a first window of a plurality of windows in a first cavity of a plurality of cavities of a first mold half.

3. The method of claim 2 wherein said forming a plurality of moldings simultaneously further comprises pressing said first window between said first mold half and a second mold half.

4. The method of claim 3 wherein said first mold half and said second mold half define a space, said forming a plurality of moldings simultaneously further comprising transferring molding compound into said space.

5. The method of claim 4 wherein said molding compound contacts sides of said first window.

6. The method of claim 5 wherein said molding compound contacts a peripheral region of a first surface of said first window.

7. The method of claim 6 wherein said molding compound contacts a peripheral region of a second surface of said first window.

8. The method of claim 1 wherein said substrate comprises a plurality of individual substrates integrally connect together in an array format.

9. The method of claim 8 further comprising attaching a first image sensor to a first individual substrate of said plurality of individual substrates.

10. The method of claim 9 wherein said bringing said molded window array into abutting contact with said substrate causes an adhesive layer to contact said molded window array and said substrate, said molded window array being attached to said substrate by said adhesive layer.

11. The method of claim 10 wherein a first molding of said plurality of moldings is attached to said first individual substrate.

12. The method of claim 11 further comprising singulating said substrate, said molded window array and said adhesive layer to form a first image sensor package.

13. The method of claim 12 wherein said first image sensor package comprises said first molding, said first image sensor and said first individual substrate.