Wafer container having electrically conductive kinematic coupling groove to detect the presence of the wafer container on a support surface, the support surface, and method
First Claim
Patent Images
1. A wafer container, comprising:
- in a base plate, at least a first kinematic coupling groove with a first groove surface that is at least partially electrically conductive; and
in said base plate, a second kinematic coupling groove with a second groove surface that is also at least partially electrically conductive, wherein an electrical conductive path extends from said first groove surface to said second groove surface so that the presence of said wafer container on a support surface provides an electrically conductive loop having a predetermined electrical resistance between kinematic coupling pins of the support surface.
22 Assignments
0 Petitions
Accused Products
Abstract
In a transportation system (100, 200) for wafers, a wafer container (100) has kinematic coupling grooves, and a support surface (200) has kinematic coupling pins. Grooves and pins are at least partially electrically conductive to allow monitoring the correct position of the container by measuring electrical resistance, as well as to allow signal exchange to and from the container (100). The kinematic coupling pins have first and second surface areas that are electrically isolated.
-
Citations
11 Claims
-
1. A wafer container, comprising:
-
in a base plate, at least a first kinematic coupling groove with a first groove surface that is at least partially electrically conductive; and
in said base plate, a second kinematic coupling groove with a second groove surface that is also at least partially electrically conductive, wherein an electrical conductive path extends from said first groove surface to said second groove surface so that the presence of said wafer container on a support surface provides an electrically conductive loop having a predetermined electrical resistance between kinematic coupling pins of the support surface. - View Dependent Claims (2, 3, 4)
-
- 5. A kinematic coupling pin to provide kinematic coupling with a kinematic coupling groove in a wafer container, said pin characterized in that a first surface area and a second surface area kinematically couple to said groove and that said first surface area is substantially electrically isolated from said second surface area.
- 7. A support surface for holding a wafer container, said support surface having at least a first kinematic coupling pin to couple to a corresponding first kinematic coupling groove in a base plate of said wafer container, said support surface characterized in that said kinematic coupling pin comprises at least first and second electrically isolated surface areas to exchange electrical signals with said container via said first kinematic coupling groove.
- 9. A support surface for holding a wafer container, said support surface having first and second kinematic coupling pins to couple to corresponding first and second kinematic coupling grooves in a base plate of said wafer container, said support surface characterized in that said kinematic coupling pins each are electrically conductive but electrically isolated from each other to exchange electrical signals with said container via said first and second kinematic coupling grooves.
-
11. Method for operating a transportation system of a wafer container and a support surface, said method comprising the following first and second steps:
-
first, placing said wafer container having a plurality of kinematic coupling grooves that are least partially electrically conductive on said support surface that has a plurality of corresponding kinematic coupling pins that are also at least partially electrically conductive to kinematically couple said grooves with said pins, and second, at least one step selected from a group of the following steps;
measuring the electrical resistance across a single groove via a single pin that has electrically isolated parts; and
measuring the electrical resistance between two grooves via two corresponding pins.
-
Specification