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Plating apparatus and method

  • US 6,391,166 B1
  • Filed: 01/15/1999
  • Issued: 05/21/2002
  • Est. Priority Date: 02/12/1998
  • Status: Expired due to Term
First Claim
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1. An apparatus for plating a film on a substrate, comprising:

  • a substrate holder configured to position the substrate to receive a plating electrolyte;

    at least two anodes configured to supply plating current to the substrate, wherein the at least two anodes are separated by an insulating wall enclosing each of the at least two anodes;

    at least two flow controllers configured to supply the plating electrolyte;

    a control system coupled to said at least two anodes and said at least two flow controllers to provide electrolyte and plating current to successive portions of the substrate to provide a uniform thickness film on the substrate by successive plating of the film on the substrate.

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