Small size electronic part and a method for manufacturing the same, and a method for forming a via hole for use in the same

• US 6,391,742 B2
• Filed: 10/05/2001
• Issued: 05/21/2002
• Est. Priority Date: 12/21/1998
• Status: Expired due to Term

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kawai, Hiroshi
• Primary Examiner(s): Bowers, Charles
• Assistant Examiner(s): GEYER, SCOTT B
• Application Number:
  US09/977,915
• Publication Number:
  US 20020019079A1
• Time in Patent Office: 228 Days
• US Class Current: 438/456
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01P 15/0802 Details

Abstract

A small size electronic part comprises a silicon substrate having a functional element and a signal output portion to output a signal from the functional element to outside the electronic part; a glass substrate provided on the silicon substrate such that the signal output portion of the silicon substrate is in contact with the glass substrate; a communicating hole provided in the glass substrate and at least a portion of the signal output portion of the silicon substrate so as to pass through the glass substrate and cut into at least a part of the signal output portion; and a conductive film provided on an inner wall surface of the communicating hole and extending on a surface of the glass substrate.

Claims

1. A method of manufacturing a small size electronic part comprising:

providing a thin portion in a silicon substrate by forming a concave groove on a first surface of the silicon substrate;

bonding a surface of a first glass substrate to the first surface of the silicon substrate;

providing a functional element and signal output portion in the thin portion of the silicon substrate;

bonding a surface of a second glass substrate having an accommodating concave portion comprising a closed space to accommodate the functional element to a second surface of the silicon substrate; and

providing a communicating hole in at least one of the glass substrates and in at least a portion of the signal output portion of the silicon substrate so as to pass through at least one of the glass substrates and cut into at least a part of the signal output portion; and

forming a conductive film on an inner wall surface of the communicating hole and extending on a surface of the glass substrate.

2. A method of manufacturing a small size electronic part comprising:

a concave portion processing step for providing a concave portion on a surface of a first glass substrate;

a first joining step for joining a first surface of a silicon substrate to the surface of the first glass substrate having the concave portion provided therein;

a functional element processing step for forming a functional element and a signal output portion to output a signal from the functional element to outside the electronic part in a part of the silicon substrate to cover the concave portion;

a second joining step for joining a surface of a second glass substrate having an accommodating concave portion comprising a closed space to accommodate the functional element to a second surface of the silicon substrate;

a communicating hole processing step for forming a communicating hole disposed so as to pass through at least one of the first and second glass substrates and further to cut into at least a part of the signal output portion; and

a conductive film processing step for providing a conductive film on an internal wall surface of the communicating hole.

3. A method of manufacturing a small size electronic part comprising:

a functional element processing step for forming a functional element and a signal output portion to output a signal from the functional element to outside the electronic part in a first silicon layer of an SOI substrate comprising an insulating film, the first silicon layer provided on a surface of the insulating film, and a second silicon layer provided on a back surface of the insulating film;

a joining step for joining a surface of a glass substrate having an accommodating concave portion comprising a closed space to accommodate the functional element to the surface of the first silicon layer of the SOI substrate;

a communicating hole processing step for providing a communicating hole passing through the glass substrate and further cut into at least a part of the signal output portion; and

a conductive film processing step for providing a conductive film on an internal wall surface of the communicating hole.

4. A method of forming a via hole for use in a small size electronic part having a functional element and a signal output portion to output a signal from the functional element to outside the electronic part comprising:

a joining step for joining surfaces of a silicon substrate and glass substrate;

a communicating hole processing step for forming a communicating hole provided so as to pass through the glass substrate and further cut into at least a part of the signal output portion; and

a conductive film processing step for forming a conductive film on an internal wall surface of the communicating hole.