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Method of depositing a copper seed layer which promotes improved feature surface coverage

  • US 6,391,776 B1
  • Filed: 01/05/2001
  • Issued: 05/21/2002
  • Est. Priority Date: 01/08/1999
  • Status: Expired due to Fees
First Claim
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1. A method of providing a copper seed layer over an interior surface of a feature upon or within a semiconductor substrate, said method comprising:

  • depositing said copper seed layer over said interior surface of said feature using copper species wherein at least 30 percent of said species are in the form of copper ions at the time said species contact said substrate surface, so that a continuous copper seed layer is formed.

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