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Micromechanical die attachment surcharge

  • US 6,392,144 B1
  • Filed: 03/01/2000
  • Issued: 05/21/2002
  • Est. Priority Date: 03/01/2000
  • Status: Expired due to Term
First Claim
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1. A structure for attaching a pair of substrates together, with at least one of the substrates comprising a semiconductor, the structure comprising:

  • (a) a first plurality of shaped barbless pillars of a substantially uniform width extending outward from and supported by a first surface of a first substrate of a pair of substrates; and

    (b) engagement means formed on a second surface of a second substrate of the pair of substrates for engaging with the outward-extending barbless pillars and forming a mechanical attachment thereto when the first and second surfaces are urged together.

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