Backplane for radio frequency signals

• US 6,392,160 B1
• Filed: 11/25/1998
• Issued: 05/21/2002
• Est. Priority Date: 11/25/1998
• Status: Expired due to Term

• Current Assignee: WSOU Investments, LLC (WSOU Holdings, LLC)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Rucki, John S., Giannoglou, Peter, Andry, Steven C., Hubbauer, Philip J., Zappala, Christopher F.
• Primary Examiner(s): Paladini, Albert W.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/200,092
• Time in Patent Office: 1,273 Days
• Field of Search: 174/33, 174/262, 174/261, 439/941, 439/63, 439/581, 361/785
• US Class Current: 174/261
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 2201/044 Details of backplane or midplane for mounting orthogonal PCBs
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09627 Special connections between adjacent vias, not for grounding vias redundant conductors or connections H05K2201/0979
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10356 Cables
• CPC Class Codes: H05K 2203/0207 Partly drilling through substrate until a controlled depth, e.g. with end-point detection
• CPC Class Codes: H05K 2203/0242 Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
• CPC Class Codes: H05K 3/0047 Drilling of holes
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

A multi-layer backplane for processing radio frequency (RF) and other signals has alternating layers of conductive traces for RF signals and other types of signals, and ground plane layers of conductive material electrically insulated from each other. The backplane upper layer has a plurality of coaxial connectors for connection of cables and other devices which supply RF energy signals to and convey them from the backplane, with each connector having a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer. A ground plane cap layer of electrically conductive material is provided below the last ground plane layer associated with a trace layer and beneath the coaxial connector center pins for preventing leakage of radio frequency energy between the center pins. A row of conductive vias can be provided along one or more sides of a trace carrying RF energy. These vias are connected to electrical ground references above and below the layer of the trace to electrically isolate the trace from radiating the RF energy. Portions of transition conductive vias and plated-through holes for the connector center pins are removed to adjust to the impedance of components and cables to which they are to be connected.

Claims

1. A multi-layer backplane comprising

alternating layers of conductive traces for radio frequency signals and ground plane layers of conductive material electrically insulated from each other by a layer of insulating material;

an upper layer having at least one connector with a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer below said upper layer;

a ground plane cap layer of electrically conductive material extending over the outer surface of a lowermost layer of insulating material below the last ground plane layer, said ground place cap layer being beneath said center pin for preventing leakage of radio frequency energy from said connector; and

a plated through-hole of electrically conductive material into which the center pin of a said connector is inserted, the electrically conductive material of said through-hole being absent from the lowermost ground plane layer of the backplane to a point somewhat below the terminal end of the said center pin to effect the impedance of said connector.

2. A multi-layer backplane as in claim 1 wherein there are a plurality of said connectors each having a respective center pin extending into said backplane to make electrical contact with a trace of a respective trace layer, said cap layer extending beneath the center pins of said plurality of connectors to prevent leakage of radio frequency energy between the connectors.

3. A multi-layer backplane as in claim 2 wherein the electrical insulation between said last ground plane layer and said cap layer is a dielectric sheet, and said cap layer extends over substantially the entirety of said dielectric sheet.

4. A multi-layer backplane as in claim 2 wherein the electrical insulation between said last ground plane layer and said cap layer is a dielectric sheet, and said cap layer is discontinuous and extends over portions of said dielectric sheet in line with said coaxial connectors.

5. A multi-layer backplane as in claim 1 further comprising at least one electrically conductive connection between said cap layer and one of said ground plane layers into said backplane.

6. A multi-layer backplane as in claim 5 wherein said at least one electrically conductive connection comprises a through-hole via of electrically conductive material from said cap layer to said ground plane layer.

7. A multi-layer backplane as in claim 5 wherein said at least one electrically conductive connection is between said cap layer and the lowermost ground plane layer.

8. A multi-layer backplane as in claim 1 wherein said upper layer has an electrical ground reference and further comprising at least one electrically conductive connection from said cap layer into said backplane to the ground plane layers above said cap layer and to said electrical ground reference of said upper layer.

9. A multi-layer backplane as in claim 8 wherein said at least one electrical connection comprises a through-hole via of electrically conductive material.

10. A multi-layer backplane as in claim 1 wherein a first group of adjacent trace layers process radio frequency signals and a second group of said trace layers process signals of non-radio frequency character.

11. A multi-layer backplane as in claim 1 wherein one of said layers of traces has two adjacent traces and at least one of said two adjacent traces carries radio frequency energy;

and further including a plurality of spaced vias of electrically conductive material along at least one side of said at least one trace carrying radio frequency energy, said plurality of vias extending through said backplane and being electrically connected to electrical ground references above and below said one layer.

12. A multi-layer backplane as in claim 1 further comprising:

a plurality of spaced vias of electrically conductive material along at lease one side of said at least one trace carrying the radio frequency energy extending through said backplane and electrically connected to electrical ground references above and below said one layer of electrically conductive traces.

13. A multi-layer backplane as in claim 12 wherein said plurality of vias are electrically connected between ground plane layers above and below said one layer of electrically conductive traces.

14. A multi-layer backplane as in claim 12 wherein there are a plurality of spaced vias along each side of said at least one trace carrying the radio frequency energy.

15. A multi-layer backplane as in claim 1 wherein one of said layers has two electrically conductive traces, at least one of which carries radio frequency energy;

and

a plurality of spaced vias of electrically conductive material along at least one side of said at least one trace carrying the radio frequency energy extending through said backplane and electrically connected to electrical ground references above and below said one layer of electrically conductive traces.

16. A multi-layer backplane comprising

alternating layers of conductive traces for radio frequency signals and ground plane layers of conductive material electrically insulated from each other by a layer of insulating material;

an upper layer having at least one connector with a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer below said upper layer;

a ground plane cap layer of electrically conductive material extending over the outer surface of a lowermost layer of insulating material below the last ground plane layer, said ground plane cap layer being beneath said center pin for preventing leakage of radio frequency energy from said connector; and

a radio frequency device mounted to the upper surface of said upper layer and a via of electrically conductive material extending into said board and connecting a terminal of said device to a trace on a respective one of said trace layers, the conductive material of said via being absent from the lowermost ground plane layer of the backplane extending to a point somewhat below said one trace layer.

17. A multi-layer backplane comprising

alternating layers of conductive traces for radio frequency signals and ground plane layers of conductive material electrically insulated from each other by a layer of insulating material;

an upper layer having at least one connector with a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer below said upper layer;

wherein one of said layers of traces has two adjacent traces and at least one of said two adjacent traces carries radio frequency energy; and

further including a plurality of spaced vias of electrically conductive material along at least one side of said at least one trace carrying radio frequency energy, said plurality of vias extending through said backplane and being electrically connected to electrical ground references above and below said one layer;

a ground plane cap layer of electrically conductive material extending over the outer surface of a lowermost layer of insulating material below the last ground plane layer, said ground plane cap layer being beneath said center pin for preventing leakage of radio frequency energy from said connector; and

a plated hole of electrically conductive material into which the center pin of a said connector is inserted, the conductive material of said hole being absent from the lowermost ground plane layer of the backplane to a point somewhat below the terminal end of a said center pin.

18. A multi-layer backplane as in claim 17 further comprising a radio frequency device mounted to the upper surface of said upper layer and a via of electrically conductive material extending into said board and connecting a terminal of said device to a trace on a respective one of said trace layers, the conductive material of said via being absent from the lowermost ground plane layer of the backplane extending to a point somewhat below said one trace layer.