Apparatus and method for utilizing a plasma density gradient to produce a flow of particles

• US 6,392,187 B1
• Filed: 05/09/2000
• Issued: 05/21/2002
• Est. Priority Date: 10/15/1997
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Johnson, Wayne L.
• Primary Examiner(s): PASCHALL, MARK H
• Application Number:
  US09/509,556
• Time in Patent Office: 742 Days
• Field of Search: 219/121.43, 219/121.41, 219/121.54, 219/121.42, 156/345, 118/719, 118/723.R, 118/723.I, 204/298.37, 204/298.38, 216/55, 216/56, 216/68
• US Class Current: 219/121.43
• CPC Class Codes: H01J 37/321 the radio frequency energy being inductively coupled to the plasma
• CPC Class Codes: H01J 37/32422 Arrangement for selecting ions or species in the plasma
• CPC Class Codes: H01J 37/3266 Magnetic control means
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence

Abstract

An apparatus and method which uses a plasma having a density gradient in order to accelerate ions, thereby producing a flow of energetic ions and neutral parties. The plasma gradient is produced by applying a non-uniform magnetic field to the plasma and/or providing non-uniform RF power to the plasma. Since the voltage within a plasma (i.e. the plasma potential) is dependent upon the density of the plasma, the plasma gradient produces an electric field within the plasma, which can be used to accelerate ions e.g., toward a substrate. This technique produces accelerated particles of lower energy than conventional systems, thereby causing less damage to a work piece being processed. In addition, since the ions accelerated by the apparatus have lower speeds than those accelerated by conventional systems, a larger proportion of the ions having time to recombine with free electrons before striking the work piece being processed. Since neutral particles are less damaging than ions, the amount of damage caused by the beam of accelerated particles is reduced further. As a result, manufacturing yields are increased, manufacturing costs are decreased, and improved lithographic resolution is possible, thereby improving performance and reducing the costs of circuits fabricated on a substrate.

Claims

1. An apparatus for producing accelerated particles, comprising:

a chamber;

a plasma generator for generating a plasma within said chamber; and

means for providing a density gradient of said plasma to thereby accelerate particles, wherein said means for providing said gradient comprises a first conductive coil and a second conductive coil disposed coaxially to said first conductive coil, wherein a first current of said first conductive coil flows in a first azimuthal direction and a second current of said second conductive coil flows in a second azimuthal direction opposite to said first azimuthal direction.

2. The apparatus as claimed in claim 1, further comprising a permanent magnet.

3. The apparatus as claimed in claim 1, further comprising a substrate holder for holding a substrate to be processed by accelerated particles produced by said apparatus.

4. The apparatus as claimed in claim 3, further comprising means for depositing a film, such that accelerated particles produced by said apparatus collide with said film during deposition of said film on said substrate.

5. The apparatus as claimed in claim 3, further comprising means for providing reactive gas to said chamber in order to produce reactive accelerated particles that reactively etch a portion of said substrate.

6. The apparatus as claimed in claim 1, further comprising a recombination section for causing accelerated ions to recombine with electrons to produce accelerated neutral particles.

7. An apparatus for producing accelerated particles, comprising:

a chamber;

a power source;

a plasma coupling element providing power from said power source to a plasma within said chamber; and

means for providing a density gradient of said plasma to thereby accelerate particles, wherein said means for providing said density gradient comprises a conductive shielding element for reducing coupling to said plasma coupling element by a first portion of said plasma as compared to a second portion of said plasma.

8. The apparatus as claimed in claim 7, wherein said conductive shielding element includes at least one slot for increasing coupling of said second portion of plasma to said plasma coupling element.

9. The apparatus as claimed in claim 8, wherein said at least one slot comprises a taper that varies in width from one end of said at least one slot to another end of said at least one slot.

10. The apparatus as claimed in claim 8, wherein said at least one slot comprises a curved taper that varies non-linearly in width from one end of said at least one slot to another end of said at least one slot.

11. The apparatus as claimed in claim 7, further comprising means for depositing a film, such that accelerated particles produced by said apparatus collide with said film during deposition of said film.

12. The apparatus as claimed in claim 7, further comprising means for providing reactive gas to said chamber in order to produce reactive accelerated particles that reactively etch a portion of said substrate.

13. The apparatus as claimed in claim 11, further comprising a recombination section for causing accelerated ions to recombine with electrons to produce accelerated neutral particles.

14. The apparatus as claimed in claim 12, further comprising a recombination section for causing accelerated ions to recombine with electrons to produce accelerated neutral particles.

15. An apparatus for producing accelerated particles, comprising:

a chamber;

a power source;

a plasma coupling element providing power from said power source to a plasma within said chamber;

a plasma generator for generating a plasma within said chamber; and

means for providing a density gradient of said plasma to thereby accelerate particles, wherein said means for providing said gradient comprises a conductive shielding element disposed more proximately to a first portion of said plasma than to a second portion of said plasma, wherein said conductive shielding element reduces coupling to said plasma coupling element by said first portion as opposed to said second portion.

16. A method for controlling a plasma, the method comprising the steps of:

providing a chamber;

generating a plasma within said chamber;

producing a density gradient of a plasma; and

accelerating particles using said density gradient, wherein said step of producing a gradient comprises;

providing an electromagnet having first and second conductive coils, wherein said second conductive coil is disposed coaxially to said first conductive coil;

providing current through said first conductive coil in a first azimuthal direction; and

providing current through said second coil in a second azimuthal direction opposite to said first azimuthal direction to produce a non-uniform magnetic field within said chamber that causes said density gradient to accelerate particles.

17. The process as claimed in claim 16, further comprising providing a permanent magnet.

18. The process as claimed in claim 16, further comprising:

providing a substrate; and

accelerating particles toward said substrate to process said substrate.

22. The process as claimed in claim 16 further comprising recombining accelerated ions with electrons to produce accelerated neutral particles.

19. The process as claimed in claim 19, further comprising depositing a film on said substrate, wherein said step of accelerating particles toward said substrate is performed concurrently with said step of depositing said film.

20. The process as claimed in claim 19, further comprising using said accelerated particles to reactively etch a portion of said substrate.

21. The process as claimed in claim 20, further comprising recombining accelerated ions with electrons to produce accelerated neutral particles.

23. A method for controlling a plasma, the method comprising the steps of:

providing a chamber;

providing a plasma coupling element;

providing power to a plasma within said chamber using said plasma coupling element;

producing a density gradient of said plasma; and

accelerating particles using said density gradient, wherein said step of providing a density gradient comprises reducing coupling to said plasma coupling element by a first portion of said plasma as compared to a second portion of said plasma.

24. The process as claimed in claim 23, wherein said step of reducing coupling comprises:

providing a conductive shielding element; and

forming at least one slot penetrating said conductive shielding element to thereby increase coupling of said second portion of said plasma to said plasma coupling element.

25. The process as claimed in claim 24, wherein said step of forming at least one slot comprises tapering said at least one slot to vary in width from one end of said at least one slot to another end of said at least one slot.

26. The process as claimed in claim 24, wherein said step of forming at least one slot comprises non-linearly tapering said at least one slot to vary non-linearly in width from one end of said at least one slot to another end of said at least one slot, thereby providing said at least one slot with a curved edge.

28. The process as claimed in claim 23, further comprising providing a substrate and accelerating particles toward said substrate to thereby process said substrate.

29. The process as claimed in claim 28, further comprising depositing a film on said substrate, wherein said step of accelerating particles toward said substrate is performed concurrently with said step of depositing said film.

30. The process as claimed in claim 28, further comprising using said accelerated particles to reactively etch a portion of said substrate.

31. The process as claimed in claim 30, further comprising recombining accelerated ions with electrons to produce accelerated neutral particles.

27. A method for controlling a plasma, the method comprising the steps of:

providing a chamber;

providing a plasma coupling element;

providing power to a plasma within said chamber using said plasma coupling element;

providing a conductive shielding element disposed more proximately to a first portion of said plasma than to a second portion of said plasma; and

forming at least one slot penetrating said conductive shielding element to thereby increase coupling of said second portion of said plasma to said plasma coupling element.