Pressure sensor component with hose connection

• US 6,393,922 B1
• Filed: 07/29/1999
• Issued: 05/28/2002
• Est. Priority Date: 01/29/1997
• Status: Expired due to Term

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Winterer, Jurgen
• Primary Examiner(s): PATEL, HARSHAD R
• Assistant Examiner(s): Aw-Musse, Abdullahi
• Application Number:
  US09/363,264
• Time in Patent Office: 1,034 Days
• Field of Search: 73/715,721,727,756,726,754 251/417,701,687,420,415,419
• US Class Current: 73/754
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/14 Housings G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

The invention relates to a pressure sensor component comprising a base body and a pressure connection element. The base body comprises a chip carrier, onto which a semiconductor chip with an integrated pressure sensor is mounted. Contact is made with the semiconductor chip by means of connection, which are routed laterally out from the base body. The base body is open on one side, and the opening is bounded by side parts of the chip carrier. The pressure connection element is placed onto the upper end regions of the side parts. The invention is distinguished by the fact that the filler, with which the inner space of the base body is filled and the semiconductor chip is covered, is simultaneously used to connect and seal the pressure connection element and the base body. The ends of the pressure connection element are preferably configured in such a way that the filler is drawn by capillary forces into the interspace between side parts and pressure connection element. The pressure connection element is particularly preferably configured in such a way that hoses of different diameter can be attached.

Claims

1. A pressure sensor component for mounting on a component-mounting surface of a printed circuit board, the component comprising:

a base body formed with a chip carrier and a semiconductor chip mounted on said chip carrier;

a flowable filler completely covering said base body;

a plurality of electrical connections to be routed out from said base body;

a tubular pressure connection element having an end fastened on said base body, said flowable filler filling interspaces formed between said end of said pressure connection element and said base body at least partially and sealing said pressure connection element gastightly against said base body.

2. The pressure sensor component according to claim 1, wherein said pressure connection element is fastened on said base body by an attachment selected from the group consisting of adhesive bonding, welding, and clamping.

3. The pressure sensor component according to claim 1, wherein said base body has a side wall encompassing said chip carrier and said semiconductor chip and forming an end region projecting towards said pressure connection element, said end of said pressure connection element engaging on both sides about said end region of said side wall, and wherein said base body and said pressure connection element are sealed against one another with said flowable filler.

4. The pressure sensor component according to claim 2, wherein said side wall is formed with a flow stop edge for said filler, and said end of said pressure connection element facing said base body has an inner wall extending along an inside of said side wall of said base body for covering said flow stop edge peripherally inside said inner wall.

5. The pressure sensor component according to claim 1, wherein said pressure connection element is formed with at least one fastening lug adapted to engage in an associated fastening recess formed in said base body.

6. The pressure sensor component according to claim 1, wherein said fastening recess is one of a fastening cutout and a fastening opening in said base body.

7. The pressure sensor component according to claim 1, wherein said base body has at least one fastening lug formed thereon adapted to engage in an associated fastening recess formed in said pressure connection element.

8. The pressure sensor component according to claim 1, wherein said pressure connection element is formed with a conical connector for attachment of hoses of respectively different diameters.

9. The pressure sensor component according to claim 1, wherein said flowable filler is a gel.

10. The pressure sensor component according to claim 1, wherein said flowable filler is a silicone resin-based gel.