Pressure sensor component with hose connection
First Claim
1. A pressure sensor component for mounting on a component-mounting surface of a printed circuit board, the component comprising:
- a base body formed with a chip carrier and a semiconductor chip mounted on said chip carrier;
a flowable filler completely covering said base body;
a plurality of electrical connections to be routed out from said base body;
a tubular pressure connection element having an end fastened on said base body, said flowable filler filling interspaces formed between said end of said pressure connection element and said base body at least partially and sealing said pressure connection element gastightly against said base body.
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Accused Products
Abstract
The invention relates to a pressure sensor component comprising a base body and a pressure connection element. The base body comprises a chip carrier, onto which a semiconductor chip with an integrated pressure sensor is mounted. Contact is made with the semiconductor chip by means of connection, which are routed laterally out from the base body. The base body is open on one side, and the opening is bounded by side parts of the chip carrier. The pressure connection element is placed onto the upper end regions of the side parts. The invention is distinguished by the fact that the filler, with which the inner space of the base body is filled and the semiconductor chip is covered, is simultaneously used to connect and seal the pressure connection element and the base body. The ends of the pressure connection element are preferably configured in such a way that the filler is drawn by capillary forces into the interspace between side parts and pressure connection element. The pressure connection element is particularly preferably configured in such a way that hoses of different diameter can be attached.
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Citations
10 Claims
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1. A pressure sensor component for mounting on a component-mounting surface of a printed circuit board, the component comprising:
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a base body formed with a chip carrier and a semiconductor chip mounted on said chip carrier;
a flowable filler completely covering said base body;
a plurality of electrical connections to be routed out from said base body;
a tubular pressure connection element having an end fastened on said base body, said flowable filler filling interspaces formed between said end of said pressure connection element and said base body at least partially and sealing said pressure connection element gastightly against said base body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification