Method of producing a laminated structure

• US 6,395,124 B1
• Filed: 07/30/1999
• Issued: 05/28/2002
• Est. Priority Date: 07/30/1999
• Status: Expired due to Term

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Oxman, Joel D., Kropp, Michael A.
• Primary Examiner(s): Ball, Michael W.
• Assistant Examiner(s): Kilkenny, Todd J.
• Application Number:
  US09/365,289
• Publication Number:
  US 20020062919A1
• Time in Patent Office: 1,033 Days
• Field of Search: 156/275.1,275.3,275.5,275.7 29/830,832 257/778,783
• US Class Current: 156/275.5
• CPC Class Codes: B32B 2037/243 Coating
• CPC Class Codes: B32B 2038/0092 Metallizing
• CPC Class Codes: B32B 2307/40 having particular optical properties
• CPC Class Codes: B32B 2429/02 Records or discs
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C08F 2/46 Polymerisation initiated by wave energy or particle radiation
• CPC Class Codes: C08F 222/102 of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
• CPC Class Codes: C08F 222/1025 of aromatic dialcohols
• CPC Class Codes: C08F 290/067 Polyurethanes; Polyureas
• CPC Class Codes: C09D 4/00 Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
• CPC Class Codes: C09J 4/00 Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
• CPC Class Codes: C09J 4/06 Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01037 : Rubidium [Rb]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 : LED

Abstract

A method of laminating a structure comprises at least two layers and a photopolymerizable adhesive composition between the layers, at least one of the layers being opaque, colored, or reflective. One or both of the layers is transmissive to actinic radiation in wavelengths in the range of greater than 400 nm and up to 1200 nm. The photopolymerizable adhesive composition absorbs radiation in the identified spectral region of the radiation transmissive layer. Curing is effected by directing radiation in the identified spectral region through the radiation transmissive layer and produces a laminated structure. An underfilled flip chip assembly on an integrated circuit board substrate can be prepared by the method described above. The photopolymerizable adhesive composition can be applied directly to one or both surfaces of an aligned integrated chip and circuit board substrate or the chip aligned on an integrated circuit board substrate can be capillary underfilled with the photopolymerizable adhesive composition, which is subsequently cured. Data storage disks can also be prepared by the method of the invention.

Claims

1. A method of laminating a structure comprising the steps of

a) providing a structure comprising at least two layers and a photopolymerizable adhesive composition between said layers,

at least one of said layers being a reflective layer that is transmissive to actinic radiation in an identified spectral region having one or more wavelengths grcater than 400 nm and up to 1200 nm, said photopolymerizable composition comprising a photopolymerizable moiety and a photoinitiator therefore that absorbs actinic radiation in said identified spectral region of said transmissive layer, said photopolymerizable moiety being polymerizable in a hydrosilation, cationic, or free radical polymerization process,

b) directing actinic radiation within said identified spectral region through said radiation transmissive layer and into said photopolymerizable composition for less than 2 minutes to cure said photopolymerizable composition,

whereby said resulting polymerized composition adheres to said layers and provides a laminated structure.

2. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises an actinic radiation transmissive colored coating.

3. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises actinic radiation transmissive metallized regions.

4. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises a metal sputtered film.

5. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises a metallized reflective film.

6. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises plastic material.

7. The method according to claim 1 wherein said transmissive reflective layer is selected from die group consisting of metallized films, multilayer optical films, and retroreflective films.

8. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises a multilayer optical film.

9. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises a retroreflective film.

10. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation comprises a non-metallized reflective film.

11. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation transmits wavelengths in the visible range.

12. The method according to claim 1 wherein said reflective layer that is transmissive to actinic radiation transmits wavelengths in the near infrared range.

13. The method according to claim 1 wherein said photopolymerizable moiety of said photopolymerizable composition comprises one or both of free-radically and cationically polymerizable materials.

14. The method according to claim 13 wherein said photopolymerizable moiety of said photopolymerizable composition comprises one or more of 1,2-, 1,3-, and 1,4-cyclic ethers and vinyl ethers.

15. The method according to claim 13 wherein said photopolymerizable composition comprises one or more ethylenically-unsaturated bonds.

16. The method according to claim 13 wherein said photopolymerizable moiety of said photopolymerizable composition comprises one or more of mono-, di-, and poly-acrylates and -methacrylates, unsaturated amides, and vinyl compounds.

17. The method according to claim 1 wherein said photopolymerizable composition is selected from the group consisting of liquids, gels, and thermoplastic layers.

18. The method according to claim 1 wherein said photopolymerizable composition provides a continuous layer.

19. The method according to claim 1 wherein said photopolymerizable composition provides a discontinuous layer when no electronic component is present.

20. The method according to claim 1 wherein said photoinitiator of said photopolymerizable composition is selected from the group consisting of organometallic complex cations, acylphosphine oxides, platinum (II) beta-diketonate complexes, and cyanine borate catalysts.

21. The method according to claim 1 wherein said photoinitiator of said photopolymerizable composition is included in a three-component photoinitiator system comprising an iodonium salt, a sensitizer, and an electron donor.

22. The method according to claim 1 wherein said laminated structure is a data storage disk.

23. The method according to claim 1 wherein said laminated structure is selected from the group consisting of multilayer and tamper-evident documents.